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• AEC-Q100 Qualified
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• 16-Bit Remote Bidirectional I/O Port (Pins GPA7,GPB7 are output only for MCP23017):- I/O pins default to input
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• High-Speed I2C Interface (MCP23017):- 100 kHz- 400 kHz- 1.7 MHz
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| • High-Speed SPI Interface (MCP23S17):- 10 MHz (maximum) |
| • Three Hardware Address Pins to Allow Up to Eight Devices On the Bus |
| • Configurable Interrupt Output Pins:- Configurable as active-high, active-low or open-drain |
| • INTA and INTB Can Be Configured to Operate Independently or Together |
| • Configurable Interrupt Source:- Interrupt-on-change from configured register defaults or pin changes |
| • Polarity Inversion Register to Configure the Polarity of the Input Port Data |
| • External Reset Input |
• Low Standby Current: 1 µA (max.)
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| • Operating Voltage:- 1.8V to 5.5V @ –40°C to +85°C- 2.7V to 5.5V @ –40°C to +85°C- 4.5V to 5.5V @ –40°C to +125°C |
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| CATALOG |
| MCP23017-E/SS COUNTRY OF ORIGIN |
MCP23017-E/SS PARAMETRIC INFO
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MCP23017-E/SS PACKAGE INFO
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MCP23017-E/SS MANUFACTURING INFO
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MCP23017-E/SS PACKAGING INFO
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MCP23017-E/SS EACD MODELS
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| COUNTRY OF ORIGIN |
| Philippines |
| Malaysia |
| Taiwan (Province of China) |
| Thailand |
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PARAMETRIC INFO
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| Number of I/Os |
16 |
| Interface Type |
I2C |
| I2C Bus Interface Mode |
Standard Mode |
| Interface Speed (kHz) |
1700 |
| Number of Addresses |
8 |
| Output Type |
Quasi Bidirectional |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Internal I/O Pull Up Resistor |
Yes |
| Maximum Quiescent Current (uA) |
1 |
| Manual Reset |
Yes |
| Interrupt Output |
Yes |
| Supplier Temperature Grade |
Extended |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Package Length (mm) |
10.2 |
| Package Width (mm) |
5.3 |
| Package Height (mm) |
1.75 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Description |
Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-150AH |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
47 |
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ECAD MODELS
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