
|
| |
• Implements CAN V2.0B at 1 Mb/s:- 0 to 8-byte length in the data field- Standard and extended data and remote frames
|
• Receive Buffers, Masks and Filters:- Two receive buffers with prioritized message storage- Six 29-bit filters- Two 29-bit masks
|
• Data Byte Filtering on the First Two Data Bytes(applies to standard data frames)
|
| • Three Transmit Buffers with Prioritization and Abort Features |
| • High-Speed SPI Interface (10 MHz):- SPI Modes 0,0 and 1,1 |
| • One-Shot mode Ensures Message Transmission is Attempted Only One Time |
| • Clock Out Pin with Programmable Prescaler:- Can be used as a clock source for other device(s) |
| • Start-of-Frame (SOF) Signal is Available for Monitoring the SOF Signal:- Can be used for time slot-based protocols and/or bus diagnostics to detect early bus degradation |
| • Interrupt Output Pin with Selectable Enables |
| • Buffer Full Output Pins Configurable as:- Interrupt output for each receive buffer- General purpose output |
| • Request-to-Send (RTS) Input Pins Individually Configurable as:- Control pins to request transmission for each transmit buffer - General purpose inputs |
| • Low-Power CMOS Technology:- Operates from 2.7V-5.5V- 5 mA active current (typical)- 1 µA standby current (typical) (Sleep mode) |
| • Temperature Ranges Supported:- Industrial (I): -40°C to +85°C- Extended (E): -40°C to +125°C |
| • AEC-Q100 Qualified |
| |
| CATALOG |
| MCP2515T-I/ML COUNTRY OF ORIGIN |
MCP2515T-I/ML PARAMETRIC INFO
|
MCP2515T-I/ML PACKAGE INFO
|
MCP2515T-I/ML MANUFACTURING INFO
|
MCP2515T-I/ML PACKAGING INFO
|
MCP2515T-I/ML EACD MODELS
|
|
| COUNTRY OF ORIGIN |
| Thailand |
| Malaysia |
|
PARAMETRIC INFO
|
| Category |
Controller |
| Maximum Data Rate |
1Mbps |
| Standard Supported |
CAN 2.0B |
| Number of Transceivers |
1 |
| Power Down Mode |
Sleep|Standby |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
10 |
|
|
PACKAGE INFO
|
| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
No Lead |
| PCB |
20 |
| Tab |
N/R |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220VGGD-1 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3300 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
|
ECAD MODELS
|

|