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| CATALOG |
| MCP2562FD-E/SN COUNTRY OF ORIGIN |
MCP2562FD-E/SN PARAMETRIC INFO
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MCP2562FD-E/SN PACKAGE INFO
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MCP2562FD-E/SN MANUFACTURING INFO
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MCP2562FD-E/SN PACKAGING INFO
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MCP2562FD-E/SN EACD MODELS
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| COUNTRY OF ORIGIN |
| China |
| Taiwan (Province of China) |
| Malaysia |
| Thailand |
| Singapore |
| Philippines |
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PARAMETRIC INFO
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| Category |
Transceiver |
| Maximum Data Rate |
8Mbps |
| Standard Supported |
ISO 11898-2|ISO 11898-5 |
| Number of Transceivers |
1 |
| Power Down Mode |
Normal|Standby |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Minimum Operating Supply Voltage (V) |
1.8|4.5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
70 |
| Manufacture Type |
High Speed CAN Transceiver |
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PACKAGE INFO
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| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.25(Min) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1|3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
100 |
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ECAD MODELS
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