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| CATALOG |
MCP4341-103E/ST COUNTRY OF ORIGIN
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MCP4341-103E/ST PARAMETRIC INFO
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MCP4341-103E/ST PACKAGE INFO
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MCP4341-103E/ST MANUFACTURING INFO
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MCP4341-103E/ST PACKAGING INFO
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MCP4341-103E/ST ECAD MODELS
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COUNTRY OF ORIGIN
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| Singapore |
| Philippines |
| Thailand |
Taiwan (Province of China)
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PARAMETRIC INFO
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| Resistance Value (KOhm) |
10 |
| Number of Positions |
128 |
| Number of Pot per Package |
4 |
| Memory Type |
Non-Volatile |
| Taper Type |
Linear |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Power Supply Type |
Single |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
0.55(Typ) |
| Minimum Single Supply Voltage (V) |
1.8 |
| Typical Single Supply Voltage (V) |
2.5|3.3|5 |
| Control Interface |
Serial (4-Wire, SPI) |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
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PACKAGE INFO
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| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
Gull-wing |
| PCB |
20 |
| Tab |
N/R |
| Package Length (mm) |
6.5 |
| Package Width (mm) |
4.4 |
| Package Height (mm) |
1 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AC |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
300 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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ECAD MODELS
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