MCP4631T-104E/ST Microchip Technology IC POT DGTL 100K DUAL 14-TSSOP

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2024/12/30 91
MCP4631T-104E/ST Microchip Technology 	IC POT DGTL 100K DUAL 14-TSSOP


CATALOG
MCP4631T-104E/ST COUNTRY OF ORIGIN
MCP4631T-104E/ST PARAMETRIC INFO
MCP4631T-104E/ST PACKAGE INFO
MCP4631T-104E/ST MANUFACTURING INFO
MCP4631T-104E/ST PACKAGING INFO
MCP4631T-104E/ST ECAD MODELS


COUNTRY OF ORIGIN
Thailand
Philippines
Singapore


PARAMETRIC INFO
Resistance Value (KOhm) 100
Number of Positions 129
Number of Pot per Package 2
Memory Type Volatile
Taper Type Linear
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Power Supply Type Single
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 0.0025(Typ)
Minimum Single Supply Voltage (V) 1.8
Typical Single Supply Voltage (V) 2.5|3.3|5
Control Interface Serial (2-Wire, I2C)


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Package Length (mm) 5
Package Width (mm) 4.4
Package Height (mm) 1
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AB-1
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 300
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS


Продукт RFQ