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• Single or Dual Resistor Network Options
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• Potentiometer or Rheostat Configuration Options
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• Resistor Network Resolution- 7-bit: 128 Resistors (129 Steps)- 8-bit: 256 Resistors (257 Steps)
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| • RAB Resistances Options of:- 5k- 10 k- 50 k- 100 k |
| • Zero-Scale to Full-Scale Wiper Operation |
| • Low Wiper Resistance: 75 (typical) |
| • Low Tempco:- Absolute (Rheostat): 50 ppm typical(0°C to 70°C)- Ratiometric (Potentiometer): 15 ppm typical |
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| CATALOG |
| MCP4661T-103E/ML COUNTRY OF ORIGIN |
MCP4661T-103E/ML PARAMETRIC INFO
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MCP4661T-103E/ML PACKAGE INFO
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MCP4661T-103E/ML MANUFACTURING INFO
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MCP4661T-103E/ML PACKAGING INFO
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MCP4661T-103E/ML EACD MODELS
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| COUNTRY OF ORIGIN |
| Thailand |
|
PARAMETRIC INFO
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| Resistance Value (KOhm) |
10 |
| Number of Positions |
256 |
| Number of Pot per Package |
2 |
| Memory Type |
Non-Volatile |
| Taper Type |
Linear |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Process Technology |
CMOS |
| Power Supply Type |
Single |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
0.0025(Typ) |
| Minimum Single Supply Voltage (V) |
1.8 |
| Typical Single Supply Voltage (V) |
2.5|3.3|5 |
| Control Interface |
Serial (2-Wire, I2C) |
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PACKAGE INFO
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| Supplier Package |
QFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
300 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3300 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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ECAD MODELS
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