MCP6004T-E/STVAO Microchip Technology IC OPAMP GP 1MHZ RRO 14TSSOP

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2024/08/2 197
MCP6004T-E/STVAO Microchip Technology 	IC OPAMP GP 1MHZ RRO 14TSSOP


• Available in 5-Lead SC-70 and 5-Lead SOT-23 Packages
• Gain Bandwidth Product: 1 MHz (typical)
• Rail-to-Rail Input/Output
• Supply Voltage: 1.8V to 6.0V
• Supply Current: IQ = 100 µA (typical)
• Phase Margin: 90° (typical)
• Temperature Range:- Industrial: -40°C to +85°C- Extended: -40°C to +125°C
• Available in Single, Dual and Quad Packages


CATALOG
MCP6004T-E/STVAO COUNTRY OF ORIGIN
MCP6004T-E/STVAO PARAMETRIC INFO
MCP6004T-E/STVAO PACKAGE INFO
MCP6004T-E/STVAO MANUFACTURING INFO
MCP6004T-E/STVAO PACKAGING INFO
MCP6004T-E/STVAO APPLICATIONS


COUNTRY OF ORIGIN
Philippines
Singapore
Thailand


PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 1.8
Number of Channels per Chip 4
Process Technology CMOS
Minimum PSRR (dB) 86(Typ)
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 6
Output Type CMOS
Maximum Quiescent Current (mA) 0.68@5.5V
Typical Gain Bandwidth Product (MHz) 1
Maximum Input Offset Voltage (mV) 4.5@5.5V
Maximum Input Offset Current (uA) 0.000001(Typ)@5.5V
Maximum Operating Supply Voltage (V) 6
Minimum CMRR (dB) 60
Maximum Supply Voltage Range (V) 6 to 9
Minimum CMRR Range (dB) 60 to 65
Typical Voltage Gain (dB) 112
Typical Slew Rate (V/us) 0.6@5.5V
Typical Output Current (mA) 30(Max)
Typical Input Noise Voltage Density (nV/rtHz) 28@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0006@5.5V
Typical Input Bias Current (uA) 0.000001@5.5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single
Input Offset Voltage Drift (uV/°C) 2(Typ)


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 14
Lead Shape Gull-wing
PCB 14
Tab N/R
Package Length (mm) 5
Package Width (mm) 4.4
Package Height (mm) 1
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AB-1
Package Outline Link to Datasheet


MANUFACTURING INFO
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 2500


APPLICATIONS
• Automotive
• Portable Equipment
• Photodiode Amplifier
• Analog Filters
• Notebooks and PDAs
• Battery-Powered Systems
Продукт RFQ