MCP601T-I/OT Microchip Technology IC OPAMP GP 2.8MHZ RRO SOT23-5

label:
2024/06/26 222

• Single-Supply: 2.7V to 6.0V
• Rail-to-Rail Output
• Input Range Includes Ground
• Gain Bandwidth Product: 2.8 MHz (typical)
• Unity-Gain Stable
• Low Quiescent Current: 230 µA/amplifier (typical)
• Chip Select (CS): MCP603 only
• Temperature Ranges:- Industrial: -40°C to +85°C- Extended: -40°C to +125°C
• AEC-Q100 Qualified. See Product Identification System (Automotive).
CATALOG
MCP601T-I/OT COUNTRY OF ORIGIN
MCP601T-I/OT PARAMETRIC INFO
MCP601T-I/OT PACKAGE INFO
MCP601T-I/OT MANUFACTURING INFO
MCP601T-I/OT PACKAGING INFO
MCP601T-I/OT EACD MODELS
MCP601T-I/OT APPLICATIONS



COUNTRY OF ORIGIN
Thailand



PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Rail to Rail Rail to Rail Output
Minimum Single Supply Voltage (V) 2.7
Number of Channels per Chip 1
Process Technology CMOS
Minimum PSRR (dB) 80
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 6
Output Type CMOS
Maximum Quiescent Current (mA) 0.325@5.5V
Typical Gain Bandwidth Product (MHz) 2.8
Maximum Input Offset Voltage (mV) 2@5.5V
Maximum Input Offset Current (uA) 0.000001(Typ)@5.5V
Maximum Operating Supply Voltage (V) 6
Maximum Input Bias Current (uA) 0.00006@5.5V@85C
Minimum CMRR (dB) 75
Maximum Supply Voltage Range (V) 6 to 9
Minimum CMRR Range (dB) 75 to 80
Typical Voltage Gain (dB) 115
Typical Slew Rate (V/us) 2.3@5.5V
Typical Settling Time (ns) 4500
Typical Output Current (mA) 30(Max)
Typical Input Noise Voltage Density (nV/rtHz) 29@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.0006@5.5V
Typical Input Bias Current (uA) 0.000001@5.5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Power Supply Type Single



PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Package Length (mm) 2.9
Package Width (mm) 1.6
Package Height (mm) 1.3(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation 2 Pin At Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed



ECAD MODELS




APPLICATIONS
• Portable Equipment
• A/D Converter Driver
• Photo Diode Pre-amp
• Analog Filters
• Data Acquisition
• Notebooks and PDAs
• Sensor Interface
Продукт RFQ