MCP6022T-I/SN Microchip Technology IC OPAMP GP 10MHZ RRO 8SOIC

label:
2024/05/13 302

• Rail-to-Rail Input/Output
• Wide Bandwidth: 10 MHz (typical)
• Low Noise: 8.7 nV/Hz at 10 kHz (typical)

• Low Offset Voltage:- Industrial Temperature: ±500 µV (max.)- Extended Temperature: ±250 µV (max.)
• Mid-Supply VREF: MCP6021 and MCP6023
• Low Supply Current: 1 mA (typical)
•  Total Harmonic Distortion:- 0.00053% (typical, G = 1 V/V)
• Unity Gain Stable
• Power Supply Range: 2.5V to 5.5V
• Temperature Range:- Industrial: -40°C to +85°C- Extended: -40°C to +125°C
CATALOG
MCP6022T-I/SN COUNTRY OF ORIGIN
MCP6022T-I/SN PARAMETRIC INFO
MCP6022T-I/SN PACKAGE INFO
MCP6022T-I/SN MANUFACTURING INFO
MCP6022T-I/SN PACKAGING INFO
MCP6022T-I/SN EACD MODELS
MCP6022T-I/SN APPLICATIONS


 
COUNTRY OF ORIGIN
Thailand
Singapore
Malaysia
China
Taiwan (Province of China)
Philippines
PARAMETRIC INFO
Manufacturer Type General Purpose Amplifier
Type General Purpose Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 2.5
Number of Channels per Chip 2
Process Technology CMOS
Minimum PSRR (dB) 74
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Maximum Quiescent Current (mA) 2.7@5.5V
Typical Gain Bandwidth Product (MHz) 10
Maximum Input Offset Voltage (mV) 0.5@5.5V
Maximum Operating Supply Voltage (V) 5.5
Maximum Input Bias Current (uA) 0.015@5.5V@85C
Minimum CMRR (dB) 70
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 70 to 71
Typical Voltage Gain (dB) 110
Typical Slew Rate (V/us) 7@5.5V
Typical Input Offset Current (uA) 0.000001@5.5V
Typical Settling Time (ns) 250
Typical Output Current (mA) 30(Max)
Typical Input Noise Voltage Density (nV/rtHz) 8.7@5.5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.003@5.5V
Typical Input Bias Current (uA) 0.000001@5.5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single


 
PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Package Length (mm) 4.9
Package Width (mm) 3.9
Package Height (mm) 1.25(Min)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Small Outline IC Narrow Body
Package Family Name SO
Package Outline Link to Datasheet


 
MANUFACTURING INFO
MSL 1|3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


 
PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 3300
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Type Embossed


 
ECAD MODELS




APPLICATIONS
• Automotive
• Multi-Pole Active Filters
• Audio Processing
• DAC Buffer
• Test Equipment
• Medical Instrumentation


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