 |
|
| • Single-Supply: 2.7V to 6.0V |
| • Rail-to-Rail Output |
| • Input Range Includes Ground |
| • Gain Bandwidth Product: 2.8 MHz (typical) |
| • Unity-Gain Stable |
| • Low Quiescent Current: 230 µA/amplifier (typical) |
| • Chip Select (CS): MCP603 only |
• Temperature Ranges:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C |
| • Available in Single, Dual, and Quad |
|
| CATALOG |
| MCP602T-I/SN COUNTRY OF ORIGIN |
| MCP602T-I/SN PARAMETRIC INFO |
| MCP602T-I/SN PACKAGE INFO |
| MCP602T-I/SN MANUFACTURING INFO |
| MCP602T-I/SN PACKAGING INFO |
| MCP602T-I/SN ECAD MODELS |
| MCP602T-I/SN APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Singapore |
| Taiwan (Province of China) |
| Thailand |
| Malaysia |
|
| PARAMETRIC INFO |
| Manufacturer Type |
Low Power Amplifier |
| Type |
Low Power Amplifier |
| Rail to Rail |
Rail to Rail Output |
| Minimum Single Supply Voltage (V) |
2.7 |
| Number of Channels per Chip |
2 |
| Process Technology |
CMOS |
| Minimum PSRR (dB) |
80 |
| Typical Single Supply Voltage (V) |
3|5 |
| Maximum Single Supply Voltage (V) |
6 |
| Output Type |
CMOS |
| Maximum Quiescent Current (mA) |
0.65@5.5V |
| Typical Gain Bandwidth Product (MHz) |
2.8 |
| Maximum Input Offset Voltage (mV) |
2@5.5V |
| Maximum Input Offset Current (uA) |
0.000001(Typ)@5.5V |
| Maximum Operating Supply Voltage (V) |
6 |
| Maximum Input Bias Current (uA) |
0.00006@5.5V@85C |
| Minimum CMRR (dB) |
75 |
| Maximum Supply Voltage Range (V) |
6 to 9 |
| Minimum CMRR Range (dB) |
75 to 80 |
| Typical Voltage Gain (dB) |
115 |
| Typical Slew Rate (V/us) |
2.3@5.5V |
| Typical Settling Time (ns) |
4500 |
| Typical Output Current (mA) |
30(Max) |
| Typical Input Noise Voltage Density (nV/rtHz) |
29@5.5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.0006@5.5V |
| Typical Input Bias Current (uA) |
0.000001@5.5V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Package Length (mm) |
4.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
1.25(Min) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
1|3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3300 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Portable Equipment |
| • A/D Converter Driver |
| • Photo Diode Pre-amp |
| • Analog Filters |
| • Data Acquisition |
| • Notebooks and PDAs |
| • Sensor Interface |
| |
| |
One-stop supplier of IC products