MCP6541UT-I/LT Microchip Technology IC COMP 1.6V SNGL P-P SC70-5

label:
2025/05/15 14
MCP6541UT-I/LT Microchip Technology IC COMP 1.6V SNGL P-P SC70-5


• Low Quiescent Current: 600 nA/Comparator (typ.)
• Rail-to-Rail Input: VSS - 0.3V to VDD + 0.3V
• CMOS/TTL-Compatible Output
• Propagation Delay: 4 µs(typical, 100 mV Overdrive)
• Wide Supply Voltage Range: 1.6V to 5.5V
• Available in Single, Dual and Quad


CATALOG
MCP6541UT-I/LT COUNTRY OF ORIGIN
MCP6541UT-I/LT PARAMETRIC INFO
MCP6541UT-I/LT PACKAGE INFO
MCP6541UT-I/LT MANUFACTURING INFO
MCP6541UT-I/LT PACKAGING INFO
MCP6541UT-I/LT ECAD MODELS
MCP6541UT-I/LT APPLICATIONS


COUNTRY OF ORIGIN
Thailand
Malaysia


PARAMETRIC INFO
Rail to Rail Rail to Rail Input/Output
Manufacturer Type General Purpose Comparator
Process Technology CMOS
Typical PSRR (dB) 80
Number of Channels per Chip 1
Output Type Push-Pull
Maximum Input Offset Voltage (mV) 7@5.5V
Maximum Input Bias Current (uA) 0.000001(Typ)@5.5V
Typical CMRR (dB) 70
Strobe Capability No
Typical Output Current (mA) 30(Max)
Maximum Propagation Delay Time (ns) 8000
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Power Supply Type Single
Maximum Operating Supply Voltage (V) 5.5
Minimum Single Supply Voltage (V) 1.6
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Maximum Quiescent Current (mA) 0.001@5.5V


PACKAGE INFO
Supplier Package SC-70
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Package Length (mm) 2
Package Width (mm) 1.25
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-203AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation 2 Pin At Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed


ECAD MODELS


APPLICATIONS
• Laptop Computers
• Mobile Phones
• Metering Systems
• Hand-held Electronics
• RC Timers
• Alarm and Monitoring Circuits
• Windowed Comparators
• Multivibrators
Продукт RFQ