MIC5504-3.3YM5-TR Microchip Technology IC REG LINEAR 3.3V 300MA SOT23-5

label:
2024/09/4 201
MIC5504-3.3YM5-TR Microchip Technology 	IC REG LINEAR 3.3V 300MA SOT23-5


• Input Voltage Range: 2.5V to 5.5V
• Fixed Output Voltages from 1.0V to 3.3V
• 300 mA Ensured Output Current
• High Output Accuracy (±2%)
• Low Quiescent Current: 38 µA
• Stable with 1 µF Ceramic Output Capacitors
• Low Dropout Voltage: 160 mV @ 300 mA
• Output Discharge Circuit: MIC5502, MIC5504
• Internal Enable Pull-Down: MIC5503, MIC5504
• Thermal-Shutdown and Current-Limit Protection
• 4-Lead 1.0 mm x 1.0 mm Ultra Thin DFN Package
• MIC5501/4 5-Lead SOT23 Package


CATALOG
MIC5504-3.3YM5-TR COUNTRY OF ORIGIN
MIC5504-3.3YM5-TR PARAMETRIC INFO
MIC5504-3.3YM5-TR PACKAGE INFO
MIC5504-3.3YM5-TR MANUFACTURING INFO
MIC5504-3.3YM5-TR PACKAGING INFO
MIC5504-3.3YM5-TR ECAD MODELS
MIC5504-3.3YM5-TR APPLICATIONS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 0.3
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Junction to Ambient 253°C/W(Typ)
Polarity Positive
Special Features Current Limit|Thermal Shutdown Protection
Load Regulation 40mV
Line Regulation 0.02%/V(Typ)
Maximum Dropout Voltage @ Current (V) 0.19@150mA|0.38@300mA
Minimum Input Voltage (V) 2.5
Maximum Input Voltage (V) 5.5
Output Voltage (V) 3.3
Typical Quiescent Current (mA) 0.038
Typical Dropout Voltage @ Current (V) 0.08@150mA|0.16@300mA
Accuracy (%) ±2
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical Ground Current @ Full Load (mA) 0.042
Typical PSRR (dB) 60
Typical Output Capacitance (uF) 1
Typical Output Noise Voltage (uVrms) 175
Output Capacitor Type Ceramic


PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 2.9
Package Width (mm) 1.6
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.8
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy

 
PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q2
Packaging Document Link to Datasheet


ECAD MODELS


APPLICATIONS
• Smartphones
• DSC, GPS, PMP, and PDAs
• Medical Devices
• Portable Electronics
• 5V Systems
Продукт RFQ