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• Input Voltage Range: 2.5V to 5.5V
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• Fixed Output Voltages from 1.0V to 3.3V
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• 300 mA Ensured Output Current
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• High Output Accuracy (±2%)
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• Low Quiescent Current: 38 µA
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• Stable with 1 µF Ceramic Output Capacitors
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• Low Dropout Voltage: 160 mV @ 300 mA
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• Output Discharge Circuit: MIC5502, MIC5504
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• Internal Enable Pull-Down: MIC5503, MIC5504
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• Thermal-Shutdown and Current-Limit Protection
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• 4-Lead 1.0 mm x 1.0 mm Ultra Thin DFN Package
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• MIC5501/4 5-Lead SOT23 Package
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CATALOG |
MIC5504-3.3YM5-TR COUNTRY OF ORIGIN
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MIC5504-3.3YM5-TR PARAMETRIC INFO
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MIC5504-3.3YM5-TR PACKAGE INFO
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MIC5504-3.3YM5-TR MANUFACTURING INFO
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MIC5504-3.3YM5-TR PACKAGING INFO
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MIC5504-3.3YM5-TR ECAD MODELS
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MIC5504-3.3YM5-TR APPLICATIONS
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COUNTRY OF ORIGIN
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Thailand
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PARAMETRIC INFO
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Type |
LDO |
Number of Outputs |
1 |
Maximum Output Current (A) |
0.3 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Output Type |
Fixed |
Output Voltage Range (V) |
1.8 to 10 |
Junction to Ambient |
253°C/W(Typ) |
Polarity |
Positive |
Special Features |
Current Limit|Thermal Shutdown Protection |
Load Regulation |
40mV |
Line Regulation |
0.02%/V(Typ) |
Maximum Dropout Voltage @ Current (V) |
0.19@150mA|0.38@300mA |
Minimum Input Voltage (V) |
2.5 |
Maximum Input Voltage (V) |
5.5 |
Output Voltage (V) |
3.3 |
Typical Quiescent Current (mA) |
0.038 |
Typical Dropout Voltage @ Current (V) |
0.08@150mA|0.16@300mA |
Accuracy (%) |
±2 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Typical Ground Current @ Full Load (mA) |
0.042 |
Typical PSRR (dB) |
60 |
Typical Output Capacitance (uF) |
1 |
Typical Output Noise Voltage (uVrms) |
175 |
Output Capacitor Type |
Ceramic |
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PACKAGE INFO
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Supplier Package |
SOT-23 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
5 |
Lead Shape |
Gull-wing |
PCB |
5 |
Tab |
N/R |
Pin Pitch (mm) |
0.95 |
Package Length (mm) |
2.9 |
Package Width (mm) |
1.6 |
Package Height (mm) |
1.1 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
2.9 |
Package Overall Width (mm) |
2.8 |
Package Overall Height (mm) |
1.45(Max) |
Seated Plane Height (mm) |
1.45(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
MO-178AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
20 to 40 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020C |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q2 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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APPLICATIONS |
• Smartphones |
• DSC, GPS, PMP, and PDAs |
• Medical Devices |
• Portable Electronics |
• 5V Systems |
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