MIC833YM5-TR Microchip Technology IC COMP LATCHED W/REF SOT23-5

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2025/06/26 0
MIC833YM5-TR Microchip Technology  IC COMP LATCHED W/REF SOT23-5


CATALOG
MIC833YM5-TR COUNTRY OF ORIGIN
MIC833YM5-TR PARAMETRIC INFO
MIC833YM5-TR PACKAGE INFO
MIC833YM5-TR MANUFACTURING INFO
MIC833YM5-TR PACKAGING INFO
MIC833YM5-TR ECAD MODELS


COUNTRY OF ORIGIN
Thailand
Malaysia


PARAMETRIC INFO
Rail to Rail No
Manufacturer Type Voltage Comparator
Number of Channels per Chip 1
Output Type Open Drain
Maximum Input Voltage Range (V) 0 to 6
Strobe Capability No
Typical Output Current (mA) 20(Max)
Maximum Propagation Delay Time (ns) 5000(Typ)
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single
Minimum Test Temperature (°C) -40
Integrated Voltage Reference Yes
Maximum Operating Supply Voltage (V) 5.5
Maximum Test Temperature (°C) 85
Integrated OP Amp No
Minimum Single Supply Voltage (V) 1.5
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Maximum Supply Current (mA) 0.001(Typ)@5.5V


PACKAGE INFO
Supplier Package SOT-23
Pin Count 5
PCB 5
Tab N/R
Package Length (mm) 2.9
Package Width (mm) 1.6
Package Height (mm) 1.1
Package Diameter (mm) N/R
Mounting Surface Mount
Package Family Name SOT
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 3000


ECAD MODELS


Продукт RFQ