MJD44H11T4G onsemi TRANS NPN 80V 8A DPAK

label:
2024/06/27 206

• BVCEO > 160V
• Ideal for Low Power Amplification and Switching
• Complementary PNP Type Available (MMBT5401)
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• An automotive-compliant part is available under separate datasheet (MMBT5551Q)
CATALOG
MJD44H11T4G COUNTRY OF ORIGIN
MJD44H11T4G PARAMETRIC INFO
MJD44H11T4G PACKAGE INFO
MJD44H11T4G MANUFACTURING INFO
MJD44H11T4G PACKAGING INFO



COUNTRY OF ORIGIN
Malaysia
China
Viet Nam



PARAMETRIC INFO
Type NPN
Configuration Single
Maximum Collector-Emitter Voltage (V) 80
Maximum Emitter Base Voltage (V) 5
Maximum Pulsed Collector Current (A) 16
Maximum DC Collector Current (A) 8
Typical Transition Frequency (MHz) 85
Material Si
Maximum Power Dissipation (mW) 1750
Collector Current for VCE Saturation (mA) 8000
Maximum Storage Time (ns) 500(Typ)
Maximum Fall Time (ns) 140(Typ)
Maximum Emitter Cut-Off Current (nA) 1000
Maximum Junction Ambient Thermal Resistance 71.4°C/W
Maximum Junction Case Thermal Resistance 6.25°C/W
Typical Output Capacitance (pF) 45
Operating Junction Temperature (°C) -55 to 150
Maximum Collector-Emitter Saturation Voltage (V) 1@0.4A@8A
Maximum Base Emitter Saturation Voltage (V) 1.5@0.8A@8A
Category Bipolar Power
Minimum DC Current Gain 60@2A@1V|40@4A@1V
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150



PACKAGE INFO
Supplier Package DPAK
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 2
Tab Tab
Pin Pitch (mm) 2.29
Package Length (mm) 6.73(Max)
Package Width (mm) 6.22(Max)
Package Height (mm) 2.38(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 6.73(Max)
Package Overall Width (mm) 10.41(Max)
Package Overall Height (mm) 2.51(Max)
Seated Plane Height (mm) 2.51(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Deca Watt Package
Package Family Name TO-252
Jedec TO-252AA
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuNi
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Suffix T4
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 16.4(Min)
Tape Pitch (mm) 8
Tape Width (mm) 16
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Tab Opposing Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed



ECAD MODELS





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