MJD45H11T4G onsemi TRANS PNP 80V 8A DPAK

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2024/08/1 182
MJD45H11T4G onsemi TRANS PNP 80V 8A DPAK


• Lead Formed for Surface Mount Application in Plastic Sleeves (No Suffix)
• Straight Lead Version in Plastic Sleeves (“−1” Suffix)
• Electrically Similar to Popular D44H/D45H Series
• Low Collector Emitter Saturation Voltage
• Fast Switching Speeds
• Complementary Pairs Simplifies Designs
• Epoxy Meets UL 94 V−0 @ 0.125 in
• NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant


CATALOG
MJD45H11T4G COUNTRY OF ORIGIN
MJD45H11T4G PARAMETRIC INFO
MJD45H11T4G PACKAGE INFO
MJD45H11T4G MANUFACTURING INFO
MJD45H11T4G PACKAGING INFO


COUNTRY OF ORIGIN
Malaysia
China
Viet Nam


PARAMETRIC INFO
Type PNP
Configuration Single
Maximum Collector-Emitter Voltage (V) 80
Maximum Emitter Base Voltage (V) 5
Maximum Pulsed Collector Current (A) 16
Maximum DC Collector Current (A) 8
Typical Transition Frequency (MHz) 90
Material Si
Maximum Power Dissipation (mW) 1750
Collector Current for VCE Saturation (mA) 8000
Maximum Emitter Cut-Off Current (nA) 1000
Maximum Junction Ambient Thermal Resistance 71.4°C/W
Maximum Junction Case Thermal Resistance 6.25°C/W
Typical Output Capacitance (pF) 130
Operating Junction Temperature (°C) -55 to 150
Maximum Storage Time (ns) 500(Typ)
Maximum Fall Time (ns) 100(Typ)
Maximum Collector-Emitter Saturation Voltage (V) 1@0.4A@8A
Maximum Base Emitter Saturation Voltage (V) 1.5@0.8A@8A
Category Bipolar Power
Minimum DC Current Gain 60@2A@1V|40@4A@1V
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package DPAK
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 2
Tab Tab
Pin Pitch (mm) 2.29
Package Length (mm) 6.73(Max)
Package Width (mm) 6.22(Max)
Package Height (mm) 2.38(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 6.73(Max)
Package Overall Width (mm) 10.41(Max)
Package Overall Height (mm) 2.51(Max)
Seated Plane Height (mm) 2.51(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Deca Watt Package
Package Family Name TO-252
Jedec TO-252AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix T4
Packaging Tape and Reel
Quantity Of Packaging 2500

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