|
| • General-Purpose Power and Switching such as Output or Driver Stages in Applications |
| • D-PAK for Surface-Mount Applications |
| • Lead-Formed for Surface Mount Application (No Suffix) |
| • Fast Switching Speeds |
| • Low Collector Emitter Saturation Voltage |
|
| CATALOG |
| MJD45H11TM COUNTRY OF ORIGIN |
| MJD45H11TM LIFECYCLE |
| MJD45H11TM PARAMETRIC INFO |
| MJD45H11TM PACKAGE INFO |
| MJD45H11TM MANUFACTURING INFO |
| MJD45H11TM PACKAGING INFO |
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Thailand |
|
| LIFECYCLE |
Obsolete
Feb 01,2020 |
|
| PARAMETRIC INFO |
| Type |
PNP |
| Configuration |
Single |
| Maximum Collector-Emitter Voltage (V) |
80 |
| Maximum Emitter Base Voltage (V) |
5 |
| Maximum DC Collector Current (A) |
8 |
| Material |
Si |
| Maximum Power Dissipation (mW) |
1750 |
| Maximum Fall Time (ns) |
100(Typ) |
| Maximum Collector-Emitter Saturation Voltage (V) |
1@0.4A@8A |
| Maximum Base Emitter Saturation Voltage (V) |
1.5@0.8A@8A |
| Category |
Bipolar Power |
| Minimum DC Current Gain |
60@2A@1V|40@4A@1V |
| Number of Elements per Chip |
1 |
| Maximum Turn-On Time (ns) |
135(Typ) |
| Maximum Transition Frequency (MHz) |
40(Typ) |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
|
| PACKAGE INFO |
| Supplier Package |
DPAK |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
2 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.29 |
| Package Length (mm) |
6.73(Max) |
| Package Width (mm) |
6.22(Max) |
| Package Height (mm) |
2.38(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.73(Max) |
| Package Overall Width (mm) |
10.41(Max) |
| Package Overall Height (mm) |
2.51(Max) |
| Seated Plane Height (mm) |
2.51(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Deca Watt Package |
| Package Family Name |
TO-252 |
| Jedec |
TO-252AA |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
CuNiSn |
|
| PACKAGING INFO |
| Packaging Suffix |
TM |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
|
|
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