MJD5731T4G onsemi TRANS PNP 350V 1A DPAK

label:
2024/08/23 208
MJD5731T4G onsemi TRANS PNP 350V 1A DPAK


• PNP Complements to the MJD47 thru MJD50 Series
• Epoxy Meets UL 94 V−0 @ 0.125 in
• These Devices are Pb−Free and are RoHS Compliant


CATALOG
MJD5731T4G COUNTRY OF ORIGIN
MJD5731T4G PARAMETRIC INFO
MJD5731T4G PACKAGE INFO
MJD5731T4G MANUFACTURING INFO
MJD5731T4G PACKAGING INFO


COUNTRY OF ORIGIN
Viet Nam
China
Malaysia


PARAMETRIC INFO
Type PNP
Configuration Single
Maximum Collector-Emitter Voltage (V) 350
Maximum Emitter Base Voltage (V) 5
Maximum DC Collector Current (A) 1
Material Si
Minimum Transition Frequency (MHz) 10
Maximum Power Dissipation (mW) 1560
Maximum Junction Ambient Thermal Resistance 80°C/W
Maximum Junction Case Thermal Resistance 8.33°C/W
Maximum Emitter Cut-Off Current (nA) 500000
Operating Junction Temperature (°C) -55 to 150
Collector Current for VCE Saturation (mA) 1000
Maximum Collector-Emitter Saturation Voltage (V) 1@0.2A@1A
Category Bipolar Power
Minimum DC Current Gain 30@0.3A@10V|10@1A@10V
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package DPAK
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 2
Tab Tab
Pin Pitch (mm) 2.29
Package Length (mm) 6.73(Max)
Package Width (mm) 6.22(Max)
Package Height (mm) 2.38(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 6.73(Max)
Package Overall Width (mm) 10.41(Max)
Package Overall Height (mm) 2.51(Max)
Seated Plane Height (mm) 2.51(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Deca Watt Package
Package Family Name TO-252
Jedec TO-252AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard N/A
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material CuNi
Number of Wave Cycles N/R

 
PACKAGING INFO
Packaging Suffix T4
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 16.4(Min)
Tape Pitch (mm) 8
Tape Width (mm) 16
Feed Hole Pitch (mm) 4
Hole Center to Component Center (mm) 2
Component Orientation Tab Opposing Sprocket Hole
Packaging Document Link to Datasheet
Tape Type Embossed
Продукт RFQ