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| CATALOG |
MK60DN256VMD10 COUNTRY OF ORIGIN
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MK60DN256VMD10 PARAMETRIC INFO
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MK60DN256VMD10 PACKAGE INFO
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MK60DN256VMD10 MANUFACTURING INFO
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MK60DN256VMD10 PACKAGING INFO
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MK60DN256VMD10 ECAD MODELS
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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| Family Name |
K60 |
| Data Bus Width (bit) |
32 |
| Device Core |
ARM Cortex M4 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
100 |
| Program Memory Type |
Flash |
| Program Memory Size |
256KB |
| RAM Size |
64KB |
| Maximum CPU Frequency (MHz) |
100 |
| GPIO |
100 |
| Number of Timers |
9 |
| ADC Channels |
42 |
| DAC Channels |
2 |
| ADC Resolution (bit) |
16/16 |
| Core Architecture |
ARM |
| Number of ADCs |
2 |
| Number of DACs |
2 |
| DAC Resolution (bit) |
12 |
| PWM |
1 |
| Watchdog |
1 |
| Analog Comparators |
3 |
| Special Features |
CAN Controller |
| Interface Type |
CAN/Ethernet/I2C/I2S/SPI/UART/USB |
| Programmability |
Yes |
| SPI |
3 |
| I2C |
2 |
| I2S |
1 |
| UART |
6 |
| USART |
0 |
| CAN |
2 |
| USB |
1 |
| Ethernet |
1 |
| Minimum Operating Supply Voltage (V) |
1.71 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
1.8|2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
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PACKAGE INFO
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| Supplier Package |
MAP-BGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
144 |
| Lead Shape |
Ball |
| PCB |
144 |
| Tab |
N/R |
| Pin Pitch (mm) |
1 |
| Package Length (mm) |
13 |
| Package Width (mm) |
13 |
| Package Height (mm) |
1.27(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
13 |
| Package Overall Width (mm) |
13 |
| Package Overall Height (mm) |
1.7(Max) |
| Seated Plane Height (mm) |
1.7(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Molded Array Process Ball Grid Array |
| Package Family Name |
BGA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
160(Min) |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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