MK64FN1M0VMD12 NXP Semiconductors IC MCU 32BIT 1MB FLASH 144MAPBGA

label:
2024/01/19 387



CATALOG
MK64FN1M0VMD12 COUNTRY OF ORIGIN
MK64FN1M0VMD12 PARAMETRIC INFO
MK64FN1M0VMD12 PACKAGE INFO
MK64FN1M0VMD12 MANUFACTURING INFO
MK64FN1M0VMD12 PACKAGING INFO
MK64FN1M0VMD12 ECAD MODELS
MK64FN1M0VMD12 FUNCTIONAL BLOCK DIAGRAM



COUNTRY OF ORIGIN
Malaysia
China



PARAMETRIC INFO
Tradename Kinetis
Data Bus Width (bit) 32
Family Name K64
Device Core ARM Cortex M4
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 120
Program Memory Type Flash
Program Memory Size 1MB
RAM Size 256KB
Maximum CPU Frequency (MHz) 120
Hardware Acceleration FPU
Trace Hardware JTAG
Encryption Standard AES
DMA Channels 16
Ethernet Interface Type MII/RMII
Ethernet Speed 10Mbps/100Mbps
Direct Memory Access No
Floating Point Unit Yes
Bluetooth No
Wi-Fi No
Multiply Accumulate No
Internal/External Clock Type Internal/External
Touch Sensing Interface No
Power On Reset No
Memory Protection Unit Yes
Temperature Sensor No
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface Yes
Number of Programmable I/Os 100
Number of Timers 10
ADC Channels 41/41
DAC Channels 2
ADC Resolution (bit) 16/16
Number of ADCs Dual
Core Architecture ARM
Number of DACs Dual
DAC Resolution (bit) 12/12
PWM 2
Watchdog 1
Analog Comparators 3
Parallel Master Port No
Real Time Clock Yes
Special Features CAN Controller
Interface Type CAN/Ethernet/I2C/I2S/SPI/UART/USB
Programmability Yes
SPI 3
I2C 3
I2S 1
UART 6
USART 0
CAN 1
USB 1
Ethernet 1
Minimum Operating Supply Voltage (V) 1.71
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Temperature Flag Opr
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55
 


PACKAGE INFO
Supplier Package MAP-BGA
Basic Package Type Ball Grid Array
Pin Count 144
Lead Shape Ball
PCB 144
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 13
Package Width (mm) 13
Package Height (mm) 1.27(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 13
Package Overall Width (mm) 13
Package Overall Height (mm) 1.7(Max)
Seated Plane Height (mm) 1.7(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Molded Array Process Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
 


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 160(Min)
Packaging Document Link to Datasheet
 


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM  

Продукт RFQ