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| CATALOG |
| MKE15Z128VLH7 COUNTRY OF ORIGIN |
| MKE15Z128VLH7 PARAMETRIC INFO |
| MKE15Z128VLH7 PACKAGE INFO |
| MKE15Z128VLH7 MANUFACTURING INFO |
| MKE15Z128VLH7 PACKAGING INFO |
| MKE15Z128VLH7 ECAD MODELS |
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| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Taiwan (Province of China) |
| Philippines |
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| PARAMETRIC INFO |
| Data Bus Width (bit) |
32 |
| Family Name |
KE1xZ |
| Device Core |
ARM Cortex M0+ |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
72 |
| Program Memory Type |
Flash |
| Program Memory Size |
128KB |
| RAM Size |
16KB |
| Maximum Expanded Memory Size |
4GB |
| Maximum CPU Frequency (MHz) |
72 |
| EEPROM |
2KB |
| Number of Programmable I/Os |
58 |
| Number of Timers |
6 |
| ADC Channels |
16/16 |
| DAC Channels |
1 |
| ADC Resolution (bit) |
12/12 |
| Number of ADCs |
Dual |
| Core Architecture |
ARM |
| Number of DACs |
Single |
| DAC Resolution (bit) |
8 |
| PWM |
3 |
| Watchdog |
2 |
| Analog Comparators |
2 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Interface Type |
I2C/SPI/UART |
| Programmability |
Yes |
| SPI |
2 |
| I2C |
2 |
| I2S |
0 |
| UART |
3 |
| USART |
0 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
3.3|5 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
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| PACKAGE INFO |
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
64 |
| Lead Shape |
Gull-wing |
| PCB |
64 |
| Tab |
N/R |
| Package Length (mm) |
10 |
| Package Width (mm) |
10 |
| Package Height (mm) |
1.45(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Package Outline |
Link to Datasheet |
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| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging |
Tray |
| Quantity Of Packaging |
160(Min) |
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| ECAD MODELS |
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