MKV11Z128VLF7 NXP Semiconductors IC MCU 32BIT 128KB FLASH 48LQFP

2024/01/9 213

CATALOG

China

Philippines

Taiwan (Province of China)

Data Bus Width (bit)	32
Family Name	KV1x
Device Core	ARM Cortex M0+
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	75
Program Memory Type	Flash
Program Memory Size	128KB
RAM Size	16KB
Maximum CPU Frequency (MHz)	75
Number of Programmable I/Os	40
Number of Timers	8
ADC Channels	2
DAC Channels	1
ADC Resolution (bit)	16/16
Number of ADCs	Dual
Core Architecture	ARM
Number of DACs	Single
DAC Resolution (bit)	12
Special Features	CAN Controller
Interface Type	CAN/I2C/SPI/UART
Programmability	Yes
SPI	1
I2C	1
I2S	0
UART	2
USART	0
CAN	1
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	1.71
Typical Operating Supply Voltage (V)	2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	105
Temperature Flag	Opr
Operating Supply Voltage (V)	2.5\|3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-55

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	48
Lead Shape	Gull-wing
PCB	48
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	7
Package Width (mm)	7
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026BBC
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	40
Number of Reflow Cycle	3
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Sn
Under Plating Material	N/A
Terminal Base Material	Cu Alloy

Packaging	Tray
Quantity Of Packaging	250(Min)