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• The MLZ series include inductors for decoupling circuits that have top-class DC superimposition characteristics and low DC resistance.
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• They are compatible with wide frequency band noise, from low to high frequency.
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• H type products have a rated current that is equivalent to that of wound coils.
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• W type products are the new standard type products that have both large current and low resistance.
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• L type products have a resistance up to 60% lower than W type products
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• Operating temperature range: –55 to +125°C (including self-temperature rise)
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| CATALOG |
| MLZ2012M1R5HT000 COUNTRY OF ORIGIN |
MLZ2012M1R5HT000 PARAMETRIC INFO
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MLZ2012M1R5HT000 PACKAGE INFO
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MLZ2012M1R5HT000 MANUFACTURING INFO
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MLZ2012M1R5HT000 PACKAGING INFO
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MLZ2012M1R5HT000 ECAD MODELS
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MLZ2012M1R5HT000 APPLICATIONS
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COUNTRY OF ORIGIN
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| Japan |
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PARAMETRIC INFO
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| Type |
Power |
| Technology |
Multi-Layer |
| Protection Style |
Shielded |
| Core Material |
Ferrite |
| Inductance (H) |
1.5u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
2M |
| Maximum DC Current (A) |
0.7(Typ) |
| Typical Temperature Rise (°C) |
20 |
| Maximum Saturation Current (A) |
0.55 |
| Maximum DC Resistance (Ohm) |
0.182 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-55 |
| Operating Temperature (°C) |
-55 to 125 |
| Polarity |
No |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
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PACKAGE INFO
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| Case Size |
0805 |
| Product Length (mm) |
2.2 |
| Product Depth (mm) |
1.45 |
| Product Height (mm) |
1.45 |
| Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
0.014 |
| Mounting |
Surface Mount |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
250 to 260 |
| Reflow Solder Time (Sec) |
10 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Blister |
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ECAD MODELS
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APPLICATIONS
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• Smart phones, tablet terminals, note PCs, various modules such as camera modules, DSCs, video games, portable memory audio
devices, navigation systems, PNDs, WLANs, SSDs
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