 |
|
| • The MLZ series include inductors for decoupling circuits that have top-class DC superimposition characteristics and low DC resistance. |
| • They are compatible with wide frequency band noise, from low to high frequency.
|
| • H type products have a rated current that is equivalent to that of wound coils.
|
| • W type products are the new standard type products that have both large current and low resistance.
|
| • L type products have a resistance up to 60% lower than W type products.
|
| • Operating temperature range: –55 to +125°C |
|
| CATALOG |
| MLZ2012N100LTD25 COUNTRY OF ORIGIN |
| MLZ2012N100LTD25 PARAMETRIC INFO |
| MLZ2012N100LTD25 PACKAGE INFO |
| MLZ2012N100LTD25 MANUFACTURING INFO |
| MLZ2012N100LTD25 PACKAGING INFO |
| MLZ2012N100LTD25 ECAD MODELS |
| MLZ2012N100LTD25 APPLICATION |
|
| COUNTRY OF ORIGIN |
| China |
| Japan |
|
| PARAMETRIC INFO |
| Type |
Power |
| Technology |
Multi-Layer |
| Protection Style |
Shielded |
| Core Material |
Ferrite |
| Inductance (H) |
10u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
2M |
| Maximum DC Current (A) |
0.5 |
| Typical Temperature Rise (°C) |
20 |
| Maximum Saturation Current (A) |
0.11 |
| Maximum DC Resistance (Ohm) |
0.39 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-55 |
| Operating Temperature (°C) |
-55 to 125 |
| Polarity |
No |
|
| PACKAGE INFO |
| Case Size |
0805 |
| Product Length (mm) |
2.2 |
| Product Depth (mm) |
1.45 |
| Product Height (mm) |
1.45 |
| Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
0.014 |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
250 to 260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
|
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
|
| ECAD MODELS |
 |
|
| APPLICATION |
| • Automotive equipment, smart phones, tablet terminals, note PCs, various modules such as camera modules, DSCs, video games, portable memory audio devices, navigation systems, PNDs, WLANs, SSDs |
|
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