MMBD7000LT1G onsemi DIODE ARRAY GP 100V 200MA SOT23

label:

2025/01/9 184

MMBD7000LT1G onsemi DIODE ARRAY GP 100V 200MA SOT23

• S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

CATALOG

MMBD7000LT1G PARAMETRIC INFO

MMBD7000LT1G PACKAGE INFO

MMBD7000LT1G MANUFACTURING INFO

MMBD7000LT1G PACKAGING INFO

MMBD7000LT1G ECAD MODELS

PARAMETRIC INFO

Type	Small Signal Switching Diode
Configuration	Dual Series
Maximum DC Reverse Voltage (V)	100
Maximum Continuous Forward Current (A)	0.2
Maximum Power Dissipation (mW)	300
Speed	Ultra Fast Recovery Rectifier
Maximum Junction Ambient Thermal Resistance	556°C/W
Peak Forward Voltage (V)	1.1@0.1A
Peak Non-Repetitive Surge Current (A)	1.6
Peak Reverse Current (uA)	3
Peak Reverse Recovery Time (ns)	4
Operating Junction Temperature (°C)	-55 to 150
Minimum Storage Temperature (°C)	-55
Maximum Storage Temperature (°C)	150
Maximum Diode Capacitance (pF)	1.5
Minimum Operating Temperature (°C)	-55
Maximum Operating Temperature (°C)	150

Supplier Package	SOT-23
Basic Package Type	Lead-Frame SMT
Pin Count	3
Lead Shape	Gull-wing
PCB	3
Tab	N/R
Pin Pitch (mm)	0.95
Package Length (mm)	2.9
Package Width (mm)	1.3
Package Height (mm)	0.94
Package Diameter (mm)	N/R
Package Overall Length (mm)	2.9
Package Overall Width (mm)	2.4
Package Overall Height (mm)	1
Seated Plane Height (mm)	1
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Small Outline Transistor
Package Family Name	SOT
Jedec	TO-236AB
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed
Under Plating Material	N/A
Terminal Base Material	CuFeNi
Shelf Life Period	24 Month
Shelf Life Condition	8°C to 30°C+30 % to 70 % RH
Number of Wave Cycles	N/R

Packaging Suffix	T1
Packaging	Tape and Reel
Quantity Of Packaging	3000
Reel Diameter (in)	7
Reel Width (mm)	8.4(Min)
Tape Pitch (mm)	4
Tape Width (mm)	8
Feed Hole Pitch (mm)	4
Hole Center to Component Center (mm)	2
Component Orientation	Single Pin At Sprocket Hole
Packaging Document	Link to Datasheet
Tape Type	Embossed