
|
|
• BVCEO > 40V
|
• IC = 200mA High Collector Current
|
• Epitaxial Planar Die Construction
|
• Ideal for Medium Power Amplification and Switching
|
• Ultra-Small Surface Mount Package |
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) |
• Halogen and Antimony Free. “Green” Device (Note 3)
|
• For automotive applications requiring specific change
control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP
capable, and manufactured in IATF 16949 certified facilities),
please contact us or your local Diodes representative.
https://www.diodes.com/quality/product-definitions/
|
|
CATALOG |
MMDT3904VC-7 COUNTRY OF ORIGIN |
MMDT3904VC-7 PARAMETRIC INFO
|
MMDT3904VC-7 PACKAGE INFO
|
MMDT3904VC-7 MANUFACTURING INFO
|
MMDT3904VC-7 PACKAGING INFO
|
|
COUNTRY OF ORIGIN |
China |
|
PARAMETRIC INFO
|
Type |
NPN |
Configuration |
Dual |
Maximum Collector-Emitter Voltage (V) |
40 |
Maximum Collector Base Voltage (V) |
60 |
Maximum Emitter Base Voltage (V) |
6 |
Maximum DC Collector Current (A) |
0.2 |
Maximum Power Dissipation (mW) |
150 |
Maximum Collector-Emitter Saturation Voltage (V) |
0.2@1mA@10mA|0.3@5mA@50mA |
Maximum Base Emitter Saturation Voltage (V) |
0.85@1mA@10mA|0.95@5mA@50mA |
Category |
Bipolar Small Signal |
Minimum DC Current Gain |
40@100uA@1V|70@1mA@1V|100@10mA@1V|60@50mA@1V|30@100mA@1V |
Number of Elements per Chip |
2 |
Maximum Transition Frequency (MHz) |
300(Min) |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
Supplier Package |
SOT-563 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
Flat |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
1.6 |
Package Width (mm) |
1.2 |
Package Height (mm) |
0.6 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
0.6 |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
Packaging Suffix |
7 |
Packaging |
Tape and Reel |
Packaging Document |
Link to Datasheet |
|
|