MMDT3904VC-7 Diodes Incorporated TRANS 2NPN 40V 0.2A SOT563

label:
2024/02/2 291



• BVCEO > 40V
• IC = 200mA High Collector Current
• Epitaxial Planar Die Construction
• Ideal for Medium Power Amplification and Switching
• Ultra-Small Surface Mount Package
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/


CATALOG
MMDT3904VC-7 COUNTRY OF ORIGIN
MMDT3904VC-7 PARAMETRIC INFO
MMDT3904VC-7 PACKAGE INFO
MMDT3904VC-7 MANUFACTURING INFO
MMDT3904VC-7 PACKAGING INFO


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Type NPN
Configuration Dual
Maximum Collector-Emitter Voltage (V) 40
Maximum Collector Base Voltage (V) 60
Maximum Emitter Base Voltage (V) 6
Maximum DC Collector Current (A) 0.2
Maximum Power Dissipation (mW) 150
Maximum Collector-Emitter Saturation Voltage (V) 0.2@1mA@10mA|0.3@5mA@50mA
Maximum Base Emitter Saturation Voltage (V) 0.85@1mA@10mA|0.95@5mA@50mA
Category Bipolar Small Signal
Minimum DC Current Gain 40@100uA@1V|70@1mA@1V|100@10mA@1V|60@50mA@1V|30@100mA@1V
Number of Elements per Chip 2
Maximum Transition Frequency (MHz) 300(Min)
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 150


PACKAGE INFO
Supplier Package SOT-563
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Flat
PCB 6
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 1.6
Package Width (mm) 1.2
Package Height (mm) 0.6
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.6
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix 7
Packaging Tape and Reel
Packaging Document Link to Datasheet

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