 |
|
| • Simplifies Circuit Design |
| • Reduces Board Space |
| • Reduces Component Count |
| • S and NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable |
| • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant |
|
| CATALOG |
| MMUN2233LT1G COUNTRY OF ORIGIN |
| MMUN2233LT1G PARAMETRIC INFO |
| MMUN2233LT1G PACKAGE INFO |
| MMUN2233LT1G MANUFACTURING INFO |
| MMUN2233LT1G PACKAGING INFO |
| MMUN2233LT1G ECAD MODELS |
|
| COUNTRY OF ORIGIN |
| China |
| Japan |
| Malaysia |
| United States of America |
|
| PARAMETRIC INFO |
| Type |
NPN |
| Configuration |
Single |
| Maximum Collector-Emitter Voltage (V) |
50 |
| Maximum Continuous DC Collector Current (mA) |
100 |
| Maximum Power Dissipation (mW) |
400 |
| Operating Junction Temperature (°C) |
-55 to 150 |
| Typical Base Emitter Resistor (KOhm) |
47 |
| Maximum Collector-Emitter Saturation Voltage (V) |
0.25@1mA@10mA |
| Minimum DC Current Gain |
80@5mA@10V |
| Typical Input Resistor (KOhm) |
4.7 |
| Typical Resistor Ratio |
0.1 |
| Minimum DC Current Gain Range |
50 to 120 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
|
| PACKAGE INFO |
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.3 |
| Package Height (mm) |
0.94 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.4 |
| Package Overall Height (mm) |
1 |
| Seated Plane Height (mm) |
1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
FeNi Alloy |
| Number of Wave Cycles |
N/R |
|
| PACKAGING INFO |
| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4(Min) |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Single Pin At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
|
| ECAD MODELS |
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