MP20051DN-LF-Z Monolithic Power Systems (MPS) IC REG LINEAR POS ADJ 1A 8SOIC

label:
2025/10/23 9



CATALOG
MP20051DN-LF-Z COUNTRY OF ORIGIN
MP20051DN-LF-Z PARAMETRIC INFO
MP20051DN-LF-Z PACKAGE INFO
MP20051DN-LF-Z MANUFACTURING INFO
MP20051DN-LF-Z PACKAGING INFO
MP20051DN-LF-Z ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 1
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Adjustable
Output Voltage Range (V) <1.8|1.8 to 10
Junction to Ambient 50°C/W
Junction to Case 10°C/W
Polarity Positive
Special Features Over Current Protection|Over Temperature Protection|Under Voltage Lockout
Load Regulation 0.3%(Typ)
Line Regulation 0.15%/V
Maximum Dropout Voltage @ Current (V) 0.28@1A|0.21@750mA|0.14@500mA
Maximum Power Dissipation (mW) 2000
Minimum Input Voltage (V) 2.5
Maximum Input Voltage (V) 5.5
Output Voltage (V) 0.8 to 5
Typical Quiescent Current (mA) 0.11
Typical Dropout Voltage @ Current (V) 0.14@1A|0.105@750mA|0.07@500mA
Accuracy (%) ±2
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical PSRR (dB) 65


PACKAGE INFO
Supplier Package SOIC N EP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.55(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.7(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline IC Narrow Body, Exposed Pad
Package Family Name SO
Jedec MS-012
Package Outline Link to Datasheet


MANUFACTURING INFO
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Number of Reflow Cycle 3
Standard J-STD-020
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix Z
Packaging Tape and Reel
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ