|
|
• 2.5V to 40V Input Range
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• 3.3µA Quiescent-Supply Current
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• Stable with Low-Value Output Ceramic Capacitor (> 0.47 μF)
|
• 150mA Specified Current
|
• 620mV Dropout at 150mA Load
|
|
| CATALOG |
MP2013AGG-Z COUNTRY OF ORIGIN
|
MP2013AGG-Z PARAMETRIC INFO
|
MP2013AGG-Z PACKAGE INFO
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MP2013AGG-Z MANUFACTURING INFO
|
MP2013AGG-Z PACKAGING INFO
|
MP2013AGG-Z ECAD MODELS
|
MP2013AGG-Z APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
0.15 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Adjustable |
| Output Voltage Range (V) |
<1.8|1.8 to 10|10 to 20 |
| Junction to Ambient |
80°C/W |
| Junction to Case |
16°C/W |
| Polarity |
Positive |
| Special Features |
Current Limit|Over Voltage Protection |
| Load Regulation |
0.01%/mA |
| Line Regulation |
0.05%/V |
| Maximum Dropout Voltage @ Current (V) |
0.85@150mA |
| Maximum Power Dissipation (mW) |
1250 |
| Minimum Input Voltage (V) |
2.5 |
| Maximum Input Voltage (V) |
40 |
| Output Voltage (V) |
1.215 to 15 |
| Typical Quiescent Current (mA) |
3.3 |
| Typical Dropout Voltage @ Current (V) |
0.6@150mA |
| Accuracy (%) |
±2 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
QFN EP |
| Pin Count |
6 |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.1(Max) |
| Package Width (mm) |
2.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Family Name |
QFN |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
Z |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Industrial/Automotive Applications |
| • Portable/Battery-Powered Equipment |
| • Ultra Low-Power Microcontrollers |
| • Cellular Handsets |
| • Medical Imaging |
| |
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