
|
|
• 3.5A, 0.18Ω, 25V Power MOSFET
|
• Uses Tiny Capacitors and Inductors
|
• Pin Selectable 700KHz or 1.3MHz FixedSwitching Frequency
|
• Programmable Soft-Start
|
• Operates with Input Voltage as Low as 2.5Vand Output Voltage as High as 22V
|
• 12V at 500mA from 5V Input
|
• UVLO, Thermal Shutdown
|
• Internal Current Limit
|
• Available in an 8-Pin MSOP and 10-PinQFN Package with Exposed Pad
|
|
| CATALOG |
MP3213DH-LF-Z COUNTRY OF ORIGIN
|
MP3213DH-LF-Z PARAMETRIC INFO
|
MP3213DH-LF-Z PACKAGE INFO
|
MP3213DH-LF-Z MANUFACTURING INFO
|
MP3213DH-LF-Z PACKAGING INFO
|
MP3213DH-LF-Z ECAD MODELS
|
MP3213DH-LF-Z FUNCTIONAL BLOCK DIAGRAM
|
MP3213DH-LF-Z APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
Step Up |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
2.5 |
| Maximum Input Voltage (V) |
22 |
| Output Voltage (V) |
3 to 22 |
| Maximum Output Current (A) |
3.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Switching Frequency (kHz) |
840|1500 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
2.5 to 22 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
700 |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.85 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
|
|
PACKAGING INFO
|
| Packaging Suffix |
Z |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
22.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
|
FUNCTIONAL BLOCK DIAGRAM
|

|
|
APPLICATIONS
|
• LCD Displays
|
• Portable Applications
|
• Handheld Computers and PDAs
|
• Digital Still and Video Cameras
|
|
|