|
|
• Wide 3.8V to 55V Operating Input Range
|
• 250mΩ Internal Power MOSFET
|
• Up to 2MHz Programmable Switching
Frequency
|
• 140μA Quiescent Current
|
• Ceramic Capacitor Stable
|
• Internal Soft-Start
|
• Up to 95% Efficiency
|
• Output Adjustable from 0.8V to 52V
|
• Available in 3x3 10-Pin QFN and SOIC8
with Exposed Pad Packages
|
|
| CATALOG |
MP4560DN-LF-Z COUNTRY OF ORIGIN
|
MP4560DN-LF-Z PARAMETRIC INFO
|
MP4560DN-LF-Z PACKAGE INFO
|
MP4560DN-LF-Z MANUFACTURING INFO
|
MP4560DN-LF-Z PACKAGING INFO
|
MP4560DN-LF-Z ECAD MODELS
|
MP4560DN-LF-Z APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Type |
Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
55 |
| Output Voltage (V) |
0.8 to 52 |
| Maximum Output Current (A) |
2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Switching Frequency (kHz) |
2000 |
| Efficiency (%) |
95 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
4.5 to 55 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
140 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC N EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.52(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.73(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2a |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
20 to 40 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020C |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
|
|
PACKAGING INFO
|
| Packaging Suffix |
Z |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
22.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• High Voltage Power Conversion
|
| • Automotive Systems |
• Industrial Power Systems
|
| • Distributed Power Systems |
| • Battery Powered Systems |
|
| |
One-stop supplier of IC products