MP6400DG-01-LF-Z Monolithic Power Systems (MPS) IC SUPERVISORY PWM

label:
2025/06/10 15
MP6400DG-01-LF-Z Monolithic Power Systems (MPS) IC SUPERVISORY PWM


• Fixed Threshold Voltages for Standard Voltage Rails From 0.9V to 5V and Adjustable Voltage From 0.4V are Available
• Low Quiescent Current: 1.6uA typ
• Power-On Reset Generator with Adjustable Delay Time: 2.1ms to 10s
• High Threshold Accuracy: ±1% typ
• Immune to Short Negative SENSE voltage


CATALOG
MP6400DG-01-LF-Z COUNTRY OF ORIGIN
MP6400DG-01-LF-Z PARAMETRIC INFO
MP6400DG-01-LF-Z PACKAGE INFO
MP6400DG-01-LF-Z MANUFACTURING INFO
MP6400DG-01-LF-Z PACKAGING INFO
MP6400DG-01-LF-Z ECAD MODELS
MP6400DG-01-LF-Z APPLICATIONS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Output Driver Active Low/Open Drain
Manual Reset Yes
Watchdog Timer No
Number of Supervisors 1
Typical Reset Threshold Voltage (V) 0.4
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Chip Enable Signals No
Power Fail Detection No
Battery Backup Switching No
Maximum Operating Supply Voltage (V) 6
Monitored Voltage (V) Adj
Maximum Power Dissipation (mW) 2500
Maximum Supply Current (uA) 1.85(Typ)
Minimum Operating Supply Voltage (V) 1.8
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Type Voltage Monitor


PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 6
Lead Shape No Lead
PCB 6
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 2.1(Max)
Package Width (mm) 2.1(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix Z
Packaging Tape and Reel
Quantity Of Packaging 5000
Reel Diameter (in) 13
Reel Width (mm) 22.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• DSP or Micro controller Applications
• Laptop/Desktop Computers
• PDAs/Hand-Held Products
• Portable/Battery-Powered Products
• FPGA/ASIC Applications
Продукт RFQ