MPC8360ECZUAJDGA NXP Semiconductors IC MPU MPC83XX 533MHZ 740TBGA

label:
2025/08/15 3
MPC8360ECZUAJDGA NXP Semiconductors IC MPU MPC83XX 533MHZ 740TBGA


CATALOG
MPC8360ECZUAJDGA COUNTRY OF ORIGIN
MPC8360ECZUAJDGA LIFECYCLE
MPC8360ECZUAJDGA PARAMETRIC INFO
MPC8360ECZUAJDGA PACKAGE INFO
MPC8360ECZUAJDGA MANUFACTURING INFO
MPC8360ECZUAJDGA PACKAGING INFO


COUNTRY OF ORIGIN
Malaysia


LIFECYCLE
Obsolete


PARAMETRIC INFO
Family Name PowerQUICC II Pro MPC83xx Processor
Data Bus Width (bit) 32
Device Core e300
Maximum Speed (MHz) 533
Instruction Set Architecture RISC
Number of CPU Cores 1
Data Cache Size 32KB
Instruction Cache Size 32KB
Ethernet Interface Type GMII/MII/RGMII/RMII
Interface Type Ethernet/I2C/SPI/UART/USB
Ethernet Speed 10Mbps/100Mbps/1000Mbps
Multiply Accumulate No
I/O Voltage (V) 1.8|2.5|3.3
Maximum Power Dissipation (mW) 5300
CAN 0
Ethernet 2
I2C 2
I2S 0
SPI 2
UART 2
USART 0
USB 1
Programmability Yes
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Temperature Flag Jun
Operating Supply Voltage (V) 1.2
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55


PACKAGE INFO
Supplier Package TBGA
Basic Package Type Ball Grid Array
Pin Count 740
Lead Shape Ball
PCB 740
Tab N/R
Pin Pitch (mm) 1
Package Length (mm) 37.5
Package Width (mm) 37.5
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.69(Max)
Mounting Surface Mount
Package Weight (g) 10.9497
Package Material Plastic
Package Description Thin Profile Ball Grid Array
Package Family Name BGA
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 40
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Ni
Terminal Base Material N/A


PACKAGING INFO
Packaging Tray
Quantity Of Packaging 21
Packaging Document Link to Datasheet


Продукт RFQ