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       | 
    
    
      | • 4.5 V to 24 V Operating Input Range  | 
    
    
      | • 2 A Continuous Load Current  | 
    
    
      | • 90 mΩ/40 mΩ Low RDS(ON) Internal Power
      MOSFETs  | 
    
    
      | • Integrated Inductor   | 
    
    
      | • Integrated VCC and Bootstrap Capacitors   | 
    
    
      | • Power-Save Mode at Light Load  | 
    
    
      | • Power Good Indicator   | 
    
    
      | • Over-Current Protection and Hiccup   | 
    
    
      | • Thermal Shutdown  | 
    
    
      | • Output Adjustable from 0.8 V   | 
    
    
      | • Available in QFN20 (3mm x 5mm x 1.6mm)
      Package   | 
    
    
      | • Total Solution Size 6.7mm x 7.3mm   | 
    
    
        
       
       | 
    
    
      | CATALOG  | 
    
    
      | MPM3620AGQV-Z COUNTRY OF ORIGIN  | 
    
    
      | MPM3620AGQV-Z PARAMETRIC INFO  | 
    
    
      | MPM3620AGQV-Z PACKAGE INFO  | 
    
    
      | MPM3620AGQV-Z MANUFACTURING INFO  | 
    
    
      | MPM3620AGQV-Z PACKAGING INFO  | 
    
    
      | MPM3620AGQV-Z ECAD MODELS    | 
    
    
      | MPM3620AGQV-Z APPLICATIONS   | 
    
    
        
       
       | 
    
    
      | COUNTRY OF ORIGIN  | 
    
    
      | China  | 
    
    
        
       
       | 
    
    
      | PARAMETRIC INFO  | 
    
    
      
      
        
          
            | Type | 
            Step Down | 
           
          
            | Number of Outputs | 
            1 | 
           
          
            | Output Voltage (V) | 
            0.8 to 19.9 | 
           
          
            | Maximum Output Current (A) | 
            2 | 
           
          
            | Minimum Operating Temperature (°C) | 
            -40 | 
           
          
            | Maximum Operating Temperature (°C) | 
            125 | 
           
          
            | Supplier Temperature Grade | 
            Industrial | 
           
          
            | Switching Regulator | 
            Yes | 
           
          
            | Minimum Input Voltage (V) | 
            4.5 | 
           
          
            | Maximum Input Voltage (V) | 
            24 | 
           
          
            | Output Type | 
            Adjustable | 
           
          
            | Load Regulation | 
            1.5%(Typ) | 
           
          
            | Switching Frequency (kHz) | 
            2400 | 
           
          
            | Typical Standby Current (mA) | 
            0.0065 | 
           
          
            | Minimum Storage Temperature (°C) | 
            -65 | 
           
          
            | Maximum Storage Temperature (°C) | 
            150 | 
           
          
            | On/Off Logic | 
            Positive | 
           
        
       
        | 
    
    
      |   | 
    
    
      | PACKAGE INFO  | 
    
    
      
      
        
          
            | Supplier Package | 
            QFN EP | 
           
          
            | Basic Package Type | 
            Non-Lead-Frame SMT | 
           
          
            | Pin Count | 
            20 | 
           
          
            | Lead Shape | 
            No Lead | 
           
          
            | PCB | 
            20 | 
           
          
            | Tab | 
            N/R | 
           
          
            | Pin Pitch (mm) | 
            0.5 | 
           
          
            | Package Length (mm) | 
            5.1(Max) | 
           
          
            | Package Width (mm) | 
            3.1(Max) | 
           
          
            | Package Height (mm) | 
            1.6(Max) | 
           
          
            | Package Diameter (mm) | 
            N/R | 
           
          
            | Seated Plane Height (mm) | 
            1.65(Max) | 
           
          
            | Mounting | 
            Surface Mount | 
           
          
            | Package Weight (g) | 
            N/A | 
           
          
            | Package Material | 
            Plastic | 
           
          
            | Package Description | 
            Quad Flat No Lead Package, Exposed Pad | 
           
          
            | Package Family Name | 
            QFN | 
           
          
            | Jedec | 
            MO-220 | 
           
        
       
        | 
    
    
      |   | 
    
    
      | MANUFACTURING INFO  | 
    
    
      
      
        
          
            | Maximum Reflow Temperature (°C) | 
            260 | 
           
          
            | Reflow Solder Time (Sec) | 
            20 to 40 | 
           
          
            | Number of Reflow Cycle | 
            3 | 
           
          
            | Standard | 
            J-STD-020C | 
           
          
            | Reflow Temp. Source | 
            Link to Datasheet | 
           
          
            | Maximum Wave Temperature (°C) | 
            N/R | 
           
          
            | Wave Solder Time (Sec) | 
            N/R | 
           
          
            | Number of Wave Cycles | 
            N/R | 
           
        
       
        | 
    
    
      |   | 
    
    
      | PACKAGING INFO  | 
    
    
      
      
        
          
            | Packaging Suffix | 
            Z | 
           
          
            | Packaging | 
            Tape and Reel | 
           
          
            | Quantity Of Packaging | 
            2500 | 
           
          
            | Reel Diameter (in) | 
            13 | 
           
          
            | Tape Pitch (mm) | 
            8 | 
           
          
            | Tape Width (mm) | 
            12 | 
           
          
            | Component Orientation | 
            Q1 | 
           
          
            | Packaging Document | 
            Link to Datasheet | 
           
        
       
        | 
    
    
      |   | 
    
    
      | ECAD MODELS   | 
    
    
         | 
    
    
        
       
       | 
    
    
      | APPLICATIONS   | 
    
    
      | • Industrial Controls  | 
    
    
      | • Medical and Imaging Equipment  | 
    
    
      | • Telecom and Networking Applications  | 
    
    
      | • LDO Replacement  | 
    
    
      | • Space and Resource-Limited Applications  | 
    
    
       
       
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