 |
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| • Resistant to high humidity and common automotive media |
| • Improved accuracy at high temperature |
| • Available in small and super small outline packages
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| • 1.5% maximum error over 0 °C to 85 °C |
| • Ideally suited for microprocessor or microcontroller-based systems |
| • Temperature compensated from -40 °C to +125 °C |
| • Durable Thermoplastic (PPS) Surface Mount Package |
|
| CATALOG |
| MPXAZ6115AP PARAMETRIC INFO |
| MPXAZ6115AP PACKAGE INFO |
| MPXAZ6115AP MANUFACTURING INFO |
| MPXAZ6115AP PACKAGING INFO |
| MPXAZ6115AP FUNCTIONAL BLOCK DIAGRAM |
| MPXAZ6115AP APPLICATIONS |
|
| PARAMETRIC INFO |
| Device Pressure Type |
Absolute |
| Equivalent Overload Pressure Range (psi) |
20 to 100 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Overload Pressure |
400kPa |
| Maximum Storage Temperature (°C) |
125 |
| Maximum Supply Current (mA) |
10 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-40 |
| Output Type |
Analog(Voltage) |
| Linearity |
Yes |
| Operating Pressure Range |
15kPa to 115kPa |
| Media |
Air |
| Typical Full Scale Output |
4.7VDC |
| Response Time (ms) |
1 |
| Typical Operating Supply Voltage (V) |
5 |
| Accuracy (%) |
±1.5 |
| Operating Supply Voltage (V) |
5 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
18.79(Max) |
| Package Width (mm) |
12.32(Max) |
| Package Height (mm) |
8.13(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
8.38(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Plastic Small Outline Package |
| Package Family Name |
SO |
| Jedec |
N/A |
|
| |
| MANUFACTURING INFO |
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging |
Tray |
| Quantity Of Packaging |
125 |
| Packaging Document |
Link to Datasheet |
|
| |
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Industrial controls |
| • Engine control/manifold absolute pressure (MAP) |
| • Weather station and weather reporting device barometers |
|
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