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• Resistant to High Humidity and Common Automotive Media
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• Improved Accuracy at High Temperature
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• Available in Small and Super Small Outline Packages
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• 1.5% Maximum Error over 0 to 85C
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• Ideally suited for Microprocessor or Microcontroller-Based Systems
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| • Temperature Compensated from -40 to +125C |
| • Durable Thermoplastic (PPS) Surface Mount Package |
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| CATALOG |
MPXHZ6115AC6T1 COUNTRY OF ORIGIN
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MPXHZ6115AC6T1 PARAMETRIC INFO
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MPXHZ6115AC6T1 PACKAGE INFO
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MPXHZ6115AC6T1 MANUFACTURING INFO
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MPXHZ6115AC6T1 PACKAGING INFO
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| MPXHZ6115AC6T1 ECAD MODELS |
MPXHZ6115AC6T1 APPLICATIONS
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COUNTRY OF ORIGIN
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Korea (Republic of)
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PARAMETRIC INFO
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| Device Pressure Type |
Absolute |
| Equivalent Overload Pressure Range (psi) |
20 to 100 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Overload Pressure |
400kPa |
| Maximum Storage Temperature (°C) |
125 |
| Maximum Supply Current (mA) |
10 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Storage Temperature (°C) |
-40 |
| Output Type |
Analog |
| Linearity |
Yes |
| Operating Pressure Range |
15kPa to 115kPa |
| Output Voltage (V) |
0.2 to 4.7 |
| Media |
Air |
| Typical Full Scale Output |
4.7VDC |
| Response Time (ms) |
1 |
| Typical Operating Supply Voltage (V) |
5 |
| Accuracy (%) |
±1.5 |
| Operating Supply Voltage (V) |
5 |
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PACKAGE INFO
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| Supplier Package |
SSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
8.26 |
| Package Width (mm) |
8.26 |
| Package Height (mm) |
9.7(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
9.91(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
N/A |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
250 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
T1 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
300 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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APPLICATIONS
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• Aviation Altimeters
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| • Industrial Controls |
• Engine Control/Manifold Absolute
Pressure (MAP)
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• Weather Station and Weather
Reporting Device Barometers
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