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• Resistant to High Humidity and Common Automotive Media
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• Improved Accuracy at High Temperature
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• Available in Small and Super Small Outline Packages
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• 1.5% Maximum Error over 0 to 85C
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• Ideally suited for Microprocessor or Microcontroller-Based Systems
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| • Temperature Compensated from -40 to +125C |
| • Durable Thermoplastic (PPS) Surface Mount Package |
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| CATALOG |
MPXHZ6115AC6U COUNTRY OF ORIGIN
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MPXHZ6115AC6U PARAMETRIC INFO
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MPXHZ6115AC6U PACKAGE INFO
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MPXHZ6115AC6U MANUFACTURING INFO
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MPXHZ6115AC6U PACKAGING INFO
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MPXHZ6115AC6U ECAD MODELS
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MPXHZ6115AC6U APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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| Taiwan (Province of China) |
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PARAMETRIC INFO
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| Category |
Programmable Delay Block |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Number of Elements per Chip |
1 |
| Minimum Operating Supply Voltage (V) |
2.25 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Typical Operating Supply Voltage (V) |
2.5|3.3|5 |
| Absolute Propagation Delay Time (ns) |
24(Typ) |
| Number of Element Inputs |
1 |
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PACKAGE INFO
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| Supplier Package |
TSOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
2.9 |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
0.9(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.9 |
| Package Overall Width (mm) |
2.8 |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
TRM |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
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APPLICATIONS
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• Aviation Altimeters
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| • Industrial Controls |
• Engine Control/Manifold Absolute
Pressure (MAP)
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• Weather Station and Weather
Reporting Device Barometers
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