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• 5.0% Maximum Error over 0 to 85C |
• Ideally Suited for Microprocessor or Microcontroller-Based Systems |
• Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package |
• Temperature Compensated over -40 to +125C |
• Patented Silicon Shear Stress Strain Gauge |
• Available in Differential and Gauge Configurations |
• Available in Surface Mount (SMT) or Through-hole (DIP) Configurations |
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CATALOG |
MPXV5010GC6T1 COUNTRY OF ORIGIN |
MPXV5010GC6T1 PARAMETRIC INFO |
MPXV5010GC6T1 PACKAGE INFO |
MPXV5010GC6T1 MANUFACTURING INFO |
MPXV5010GC6T1 PACKAGING INFO |
MPXV5010GC6T1 APPLICATIONS |
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COUNTRY OF ORIGIN |
Korea |
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PARAMETRIC INFO |
Device Pressure Type |
Gage |
Equivalent Overload Pressure Range (psi) |
<20 |
Maximum Operating Supply Voltage (V) |
5.25 |
Maximum Operating Temperature (°C) |
125 |
Maximum Overload Pressure |
40kPa |
Maximum Storage Temperature (°C) |
125 |
Maximum Supply Current (mA) |
10 |
Minimum Operating Supply Voltage (V) |
4.75 |
Minimum Operating Temperature (°C) |
-40 |
Minimum Storage Temperature (°C) |
-40 |
Output Type |
Analog(Voltage) |
Linearity |
Yes |
Operating Pressure Range |
0kPa to 10kPa |
Output Voltage (V) |
0.2 to 4.7 |
Media |
Air |
Typical Full Scale Output |
4.7VDC |
Response Time (ms) |
1 |
Typical Operating Supply Voltage (V) |
5 |
Accuracy (%) |
±5 |
Operating Supply Voltage (V) |
5 |
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PACKAGE INFO |
Supplier Package |
SOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
2.54 |
Package Length (mm) |
11.38(Max) |
Package Width (mm) |
11.38(Max) |
Package Height (mm) |
12.96(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
13.21(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Plastic Small Outline Package |
Package Family Name |
SO |
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MANUFACTURING INFO |
MSL |
N/A |
Maximum Reflow Temperature (°C) |
245 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO |
Packaging Suffix |
T1 |
Packaging |
Tape and Reel |
Quantity Of Packaging |
100 |
Packaging Document |
Link to Datasheet |
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APPLICATIONS |
• Hospital Beds |
• HVAC |
• Respiratory Systems |
• Process Control |
• Washing Machine Water Level
Measurement (Reference AN1950)
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• Ideally Suited for Microprocessor or
Microcontroller-Based Systems |
• Appliance Liquid Level and Pressure
Measurement |
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