 |
|
| • Noise reduction solution for power line.
|
| • Compared to the MMZ series, has low direct current resistance for compatibility with large currents, optimal for low power consumption. |
| • Performs well even in signal lines where low direct current resistance is required. |
| • Operating temperature range: –55 to +125°C |
|
| CATALOG |
| MPZ2012S331AT000 COUNTRY OF ORIGIN |
| MPZ2012S331AT000 PARAMETRIC INFO |
| MPZ2012S331AT000 PACKAGE INFO |
| MPZ2012S331AT000 MANUFACTURING INFO |
| MPZ2012S331AT000 PACKAGING INFO |
| MPZ2012S331AT000 ECAD MODELS |
| MPZ2012S331AT000 APPLICATION |
|
| COUNTRY OF ORIGIN |
| Japan |
|
| PARAMETRIC INFO |
| Type |
Multi-Layer Power |
| Impedance (Ohm) |
330 |
| Tolerance |
25% |
| Test Frequency (Hz) |
100M |
| Maximum DC Current (A) |
2.5 |
| Maximum DC Resistance (Ohm) |
0.05 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Terminal Width (mm) |
0.8 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
|
| |
| PACKAGE INFO |
| Case Size |
0805 |
| Product Length (mm) |
2.2 |
| Product Depth (mm) |
1.45 |
| Product Height (mm) |
1.05 |
| Product Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Product Weight (g) |
0.008 |
|
| |
| MANUFACTURING INFO |
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/A |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
4000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Paper |
| Tape Type |
Punched |
|
| |
| ECAD MODELS |
 |
|
| APPLICATION |
| • Noise removal for mobile devices such as smartphones and tablet terminals, and various modules. |
| • Noise removal for PCs and recorders, household appliances such as STBs, smart grids, and industrial equipment. |
|
|
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