 |
|
| • Unmatched Input and Output Allowing Wide Frequency Range Utilization |
| • Device can be used Single--Ended or in a Push--Pull Configuration |
| • Qualified Up to a Maximum of 50 VDD Operation |
| • Characterized from 30 V to 50 V for Extended Power Range |
| • Suitable for Linear Application with Appropriate Biasing |
| • Integrated ESD Protection |
| • Greater Negative Gate--Source Voltage Range for Improved Class C Operation |
| • Characterized with Series Equivalent Large--Signal Impedance Parameters |
| • RoHS Compliant |
| • NI--780--4 in Tape and Reel. R3 Suffix = 250 Units, 56 mm Tape Width,
13 inch Reel. For R5 Tape and Reel options, see p. 14. |
| • NI--780S--4 in Tape and Reel. R3 Suffix = 250 Units, 32 mm Tape Width,
13 inch Reel. For R5 Tape and Reel options, see p. 14. |
|
| CATALOG |
| MRFE6VP6300HR5 COUNTRY OF ORIGIN |
| MRFE6VP6300HR5 PARAMETRIC INFO |
| MRFE6VP6300HR5 PACKAGE INFO |
| MRFE6VP6300HR5 MANUFACTURING INFO |
| MRFE6VP6300HR5 PACKAGING INFO |
|
| COUNTRY OF ORIGIN |
| Malaysia |
|
| PARAMETRIC INFO |
| Channel Type |
N |
| Configuration |
Dual Common Source |
| Maximum Drain Source Voltage (V) |
130 |
| Maximum Frequency (MHz) |
600 |
| Output Power (W) |
300(Typ) |
| Maximum Power Dissipation (mW) |
1050000 |
| Typical Output Capacitance @ Vds (pF) |
76@50V |
| Typical Reverse Transfer Capacitance @ Vds (pF) |
0.8@50V |
| Maximum VSWR |
65 |
| Typical Power Gain @ Vds (dB) |
26.5 |
| Minimum Frequency (MHz) |
1.8 |
| Mode of Operation |
CW |
| Typical Drain Efficiency (%) |
74 |
| Typical Input Capacitance @ Vds (pF) |
188@50V |
| Number of Elements per Chip |
2 |
| Process Technology |
LDMOS |
| Types of Output Stages |
Push Pull |
| Typical Power Gain (dB) |
26.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Channel Mode |
Enhancement |
| Maximum Gate Source Voltage (V) |
10 |
| Minimum Operating Temperature (°C) |
-65 |
| Maximum Operating Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
NI-780 |
| Pin Count |
5 |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
8.88 |
| Package Length (mm) |
34.16(Max) |
| Package Width (mm) |
9.91(Max) |
| Package Height (mm) |
4.32(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
4.32(Max) |
| Mounting |
Screw |
| Package Material |
Plastic |
| Package Family Name |
N/A |
| Jedec |
N/A |
|
| |
| MANUFACTURING INFO |
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
N/A |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R5 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
50 |
| Packaging Document |
Link to Datasheet |
|
|
One-stop supplier of IC products