MSP430AFE253IPWR Texas Instruments MSP430AFE2x3, MSP430AFE2x2, MSP430AFE2x1 Mixed-Signal Microcontrollers

label:
2025/02/7 68
MSP430AFE253IPWR Texas Instruments MSP430AFE2x3, MSP430AFE2x2, MSP430AFE2x1 Mixed-Signal Microcontrollers


• Low Supply Voltage Range: 1.8 V to 3.6 V
• Ultra-Low Power Consumption– Active Mode: 220 µA at 1 MHz, 2.2 V– Standby Mode: 0.5 µA– Off Mode (RAM Retention): 0.1 µA
• Five Power-Saving Modes
• Ultra-Fast Wake-up From Standby Mode in Less Than 1 µs
• 16-Bit RISC Architecture, up to 12-MHz System Clock
• Basic Clock Module Configurations– Internal Frequencies up to 12 MHz With Two Calibrated Frequencies– Internal Very-Low-Power Low-Frequency (LF)
Oscillator– High-Frequency (HF) Crystal up to 16 MHz– Resonator– External Digital Clock Source


CATALOG
MSP430AFE253IPWR COUNTRY OF ORIGIN
MSP430AFE253IPWR PARAMETRIC INFO
MSP430AFE253IPWR PACKAGE INFO
MSP430AFE253IPWR MANUFACTURING INFO
MSP430AFE253IPWR PACKAGING INFO
MSP430AFE253IPWR ECAD MODELS
MSP430AFE253IPWR APPLICATIONS


COUNTRY OF ORIGIN
China
Malaysia
Taiwan (Province of China)


PARAMETRIC INFO
Tradename MSP430
Family Name MSP430
Data Bus Width (bit) 16
Device Core MSP430
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 12
Program Memory Type Flash
Program Memory Size 16KB
RAM Size 512B
Touch Sensing Interface No
Power On Reset Yes
Memory Protection Unit No
Temperature Sensor Yes
DDR No
Memory Management Unit No
Integrated Development Environment No
Super Scalar No
External Bus Interface No
Direct Memory Access No
Floating Point Unit No
Bluetooth No
Wi-Fi No
Multiply Accumulate Yes
Maximum CPU Frequency (MHz) 12
Number of Programmable I/Os 11
Number of Timers 3
ADC Resolution (bit) 24/24/24
LIN 0
Number of Cores 1
Core Architecture MSP430
Number of ADCs 3
Watchdog 1
Parallel Master Port No
Real Time Clock No
Timers Resolution (bit) 16
Interface Type SPI/UART/USART
Programmability Yes
SPI 1
I2C 0
I2S 0
UART 1
USART 1
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Operating Supply Voltage (V) 2.5|3.3
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -55
Maximum Supply Current (mA) 1.1


PACKAGE INFO
Supplier Package TSSOP
Basic Package Type Lead-Frame SMT
Pin Count 24
Lead Shape Gull-wing
PCB 24
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 7.9(Max)
Package Width (mm) 4.5(Max)
Package Height (mm) 1.05(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 7.9(Max)
Package Overall Width (mm) 6.6(Max)
Package Overall Height (mm) 1.2(Max)
Seated Plane Height (mm) 1.2(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-153AD
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 1.05
Minimum PACKAGE_DIMENSION_H N/A
Maximum PACKAGE_DIMENSION_L 7.9
Minimum PACKAGE_DIMENSION_L 7.7
Maximum PACKAGE_DIMENSION_W 4.5
Minimum PACKAGE_DIMENSION_W 4.3
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.2
Minimum Seated_Plane_Height N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2000
Reel Diameter (in) 13
Reel Width (mm) 16.4
Tape Pitch (mm) 8
Tape Width (mm) 16
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS


APPLICATIONS
• Single-Phase Electricity Meters
• Digital Power Monitoring
Продукт RFQ