
|
|
• Low Supply Voltage Range: 1.8 V to 3.6 V
|
• Ultra-Low Power Consumption– Active Mode: 220 µA at 1 MHz, 2.2 V– Standby Mode: 0.5 µA– Off Mode (RAM Retention): 0.1 µA
|
• Five Power-Saving Modes
|
• Ultra-Fast Wake-up From Standby Mode in Less Than 1 µs
|
• 16-Bit RISC Architecture, up to 12-MHz System Clock
|
• Basic Clock Module Configurations– Internal Frequencies up to 12 MHz With Two Calibrated Frequencies– Internal Very-Low-Power Low-Frequency (LF)
Oscillator– High-Frequency (HF) Crystal up to 16 MHz– Resonator– External Digital Clock Source
|
|
| CATALOG |
MSP430AFE253IPWR COUNTRY OF ORIGIN
|
MSP430AFE253IPWR PARAMETRIC INFO
|
MSP430AFE253IPWR PACKAGE INFO
|
MSP430AFE253IPWR MANUFACTURING INFO
|
MSP430AFE253IPWR PACKAGING INFO
|
MSP430AFE253IPWR ECAD MODELS
|
MSP430AFE253IPWR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Malaysia
|
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Tradename |
MSP430 |
| Family Name |
MSP430 |
| Data Bus Width (bit) |
16 |
| Device Core |
MSP430 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
12 |
| Program Memory Type |
Flash |
| Program Memory Size |
16KB |
| RAM Size |
512B |
| Touch Sensing Interface |
No |
| Power On Reset |
Yes |
| Memory Protection Unit |
No |
| Temperature Sensor |
Yes |
| DDR |
No |
| Memory Management Unit |
No |
| Integrated Development Environment |
No |
| Super Scalar |
No |
| External Bus Interface |
No |
| Direct Memory Access |
No |
| Floating Point Unit |
No |
| Bluetooth |
No |
| Wi-Fi |
No |
| Multiply Accumulate |
Yes |
| Maximum CPU Frequency (MHz) |
12 |
| Number of Programmable I/Os |
11 |
| Number of Timers |
3 |
| ADC Resolution (bit) |
24/24/24 |
| LIN |
0 |
| Number of Cores |
1 |
| Core Architecture |
MSP430 |
| Number of ADCs |
3 |
| Watchdog |
1 |
| Parallel Master Port |
No |
| Real Time Clock |
No |
| Timers Resolution (bit) |
16 |
| Interface Type |
SPI/UART/USART |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
0 |
| I2S |
0 |
| UART |
1 |
| USART |
1 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Supply Current (mA) |
1.1 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
Gull-wing |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
7.9(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
7.9(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AD |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1.05 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
7.9 |
| Minimum PACKAGE_DIMENSION_L |
7.7 |
| Maximum PACKAGE_DIMENSION_W |
4.5 |
| Minimum PACKAGE_DIMENSION_W |
4.3 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.2 |
| Minimum Seated_Plane_Height |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
16.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
|
|
| APPLICATIONS |
| • Single-Phase Electricity Meters |
| • Digital Power Monitoring |
| |