|
|
• Low supply voltage range: 3.6 V down to 1.8 V
|
• Wake up from standby mode in 3.5 µs (typical)
|
• 16-bit RISC architecture, extended memory, up to 25-MHz system clock
|
• 16-bit timer TA0, Timer_A with five capture/ compare registers
|
|
| CATALOG |
MSP430F5529IPNR COUNTRY OF ORIGIN
|
MSP430F5529IPNR PARAMETRIC INFO
|
MSP430F5529IPNR PACKAGE INFO
|
MSP430F5529IPNR MANUFACTURING INFO
|
MSP430F5529IPNR PACKAGING INFO
|
MSP430F5529IPNR ECAD MODELS
|
MSP430F5529IPNR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Philippines
|
|
PARAMETRIC INFO
|
| Family Name |
MSP430 |
| Data Bus Width (bit) |
16 |
| Device Core |
MSP430 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
25 |
| Program Memory Type |
Flash |
| Program Memory Size |
128KB |
| RAM Size |
10KB |
| Maximum CPU Frequency (MHz) |
25 |
| Number of Programmable I/Os |
63 |
| Number of Timers |
4 |
| ADC Channels |
16 |
| ADC Resolution (bit) |
12 |
| Core Architecture |
MSP430 |
| Number of ADCs |
1 |
| Watchdog |
1 |
| Parallel Master Port |
No |
| Real Time Clock |
Yes |
| Interface Type |
I2C/SPI/UART/USB |
| Programmability |
Yes |
| SPI |
4 |
| I2C |
2 |
| I2S |
0 |
| UART |
2 |
| USART |
0 |
| CAN |
0 |
| USB |
1 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
|
|
PACKAGE INFO
|
| Supplier Package |
LQFP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
80 |
| Lead Shape |
Gull-wing |
| PCB |
80 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
12.2(Max) |
| Package Width (mm) |
12.2(Max) |
| Package Height (mm) |
1.45(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
14.2(Max) |
| Package Overall Width (mm) |
14.2(Max) |
| Package Overall Height (mm) |
1.6(Max) |
| Seated Plane Height (mm) |
1.6(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Low Profile Quad Flat Package |
| Package Family Name |
QFP |
| Jedec |
MS-026BDD |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
1000 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Analog and digital sensor systems |
| • Data loggers |
| • Connection to USB hosts |
| |
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