|
|
• Low Supply-Voltage Range: 1.8 V to 3.6 V
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• Five Power-Saving Modes
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• Ultra-Fast Wake up From Standby Mode in Less Than 1 µs
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• 16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time
|
• Two 16-Bit Timer_A With Three Capture/Compare Registers
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• Up to 24 Capacitive-Touch Enabled I/O Pins
|
|
| CATALOG |
MSP430G2533IPW28R COUNTRY OF ORIGIN
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MSP430G2533IPW28R PARAMETRIC INFO
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MSP430G2533IPW28R PACKAGE INFO
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MSP430G2533IPW28R MANUFACTURING INFO
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MSP430G2533IPW28R PACKAGING INFO
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MSP430G2533IPW28R ECAD MODELS
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MSP430G2533IPW28R APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
Taiwan (Province of China)
|
Malaysia
|
|
PARAMETRIC INFO
|
| Family Name |
MSP430 |
| Data Bus Width (bit) |
16 |
| Device Core |
MSP430 |
| Instruction Set Architecture |
RISC |
| Maximum Clock Rate (MHz) |
16 |
| Program Memory Type |
Flash |
| Program Memory Size |
16KB |
| RAM Size |
512B |
| Maximum CPU Frequency (MHz) |
16 |
| GPIO |
24 |
| Number of Timers |
2 |
| ADC Channels |
8 |
| ADC Resolution (bit) |
10 |
| Core Architecture |
MSP430 |
| Number of ADCs |
1 |
| Watchdog |
1 |
| Interface Type |
I2C/SPI/UART |
| Programmability |
Yes |
| SPI |
1 |
| I2C |
1 |
| I2S |
0 |
| UART |
1 |
| USART |
0 |
| CAN |
0 |
| USB |
0 |
| Ethernet |
0 |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Temperature Flag |
Opr |
| Operating Supply Voltage (V) |
2.5|3.3 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-55 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
28 |
| Lead Shape |
Gull-wing |
| PCB |
28 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
9.8(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.8(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AE |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
12 |
| Tape Width (mm) |
16 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Power Management |
| • Capacitive Touch |
| • Sensor Interface |
| |
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