MT25QL256ABA1EW9-0SIT Micron IC FLASH 256M SPI 133MHZ 8WPDFN

label:
2025/09/19 33
MT25QL256ABA1EW9-0SIT Micron IC FLASH 256M SPI 133MHZ 8WPDFN


• SPI-compatible serial bus interface
• Single and double transfer rate (STR/DTR)
• Clock frequency– 133 MHz (MAX) for all protocols in STR– 90 MHz (MAX) for all protocols in DTR
• Dual/quad I/O commands for increased throughput up to 90 MB/s


CATALOG
MT25QL256ABA1EW9-0SIT COUNTRY OF ORIGIN
MT25QL256ABA1EW9-0SIT PARAMETRIC INFO
MT25QL256ABA1EW9-0SIT PACKAGE INFO
MT25QL256ABA1EW9-0SIT MANUFACTURING INFO
MT25QL256ABA1EW9-0SIT PACKAGING INFO


COUNTRY OF ORIGIN
China
Taiwan (Province of China)


PARAMETRIC INFO
Density (bit) 256M
Cell Type NOR
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Block Organization Symmetrical
Boot Block Yes
Timing Type Synchronous
Architecture Sectored
Maximum Access Time (ns) 6
Maximum Cycle Time (s) 8m
Programmability Yes
Typical Operating Supply Voltage (V) 3|3.3
Minimum Operating Temperature (°C) -40
I/O Mode Serial
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Number of Bits per Word (bit) 1/2/4
Number of Words 256M/128M/64M
Location of Boot Block Bottom|Top
Maximum Supply Current (mA) 35
Maximum Operating Frequency (MHz) 133
Sector Size 64Kbyte x 512
Program Current (mA) 35
Address Width (bit) 32
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 1/Sector
Maximum Programming Time (ms) 1.8/Page
Command Compatible Yes
ECC Support No
Erase Suspend/Resume Modes Support Yes
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode No
Page Size 256byte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 268435456


PACKAGE INFO
Supplier Package WPDFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 6
Package Width (mm) 8
Package Height (mm) 0.7(Min)
Package Diameter (mm) N/R
Package Overall Length (mm) 6
Package Overall Width (mm) 8
Package Overall Height (mm) 0.75
Seated Plane Height (mm) 0.75
Mounting Surface Mount
Terminal Width (mm) 0.4
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Dual Flat Package No Lead, Exposed Pad
Package Family Name DFN
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/A
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tray


Продукт RFQ