MT25QU512ABB8E12-0AAT Micron IC FLASH 512M SPI 24TPBGA

label:

2024/03/8 371

• SPI-compatible serial bus interface

• Single and double transfer rate (STR/DTR)

• Clock frequency
– 166 MHz (MAX) for all protocols in STR
– 90 MHz (MAX) for all protocols in DTR

• Dual/quad I/O commands for increased throughput up to 90 MB/s

• Supported protocols in both STR and DTR
– Extended I/O protocol
– Dual I/O protocol
– Quad I/O protocol

• Execute-in-place (XIP)

• PROGRAM/ERASE SUSPEND operations

• Volatile and nonvolatile configuration settings

• Software reset

• Additional reset pin for selected part numbers

• 3-byte and 4-byte address modes – enable memoryaccess beyond 128Mb

• Dedicated 64-byte OTP area outside main memory
– Readable and user-lockable
– Permanent lock with PROGRAM OTP command

• Erase capability
– Bulk erase
– Sector erase 64KB uniform granularity
– Subsector erase 4KB, 32KB granularity

• Security and write protection
– Volatile and nonvolatile locking and softwarewrite protection for each 64KB sector
– Nonvolatile configuration locking
– Password protection
– Hardware write protection: nonvolatile bits(BP[3:0] and TB) define protected area size
– Program/erase protection during power-up
– CRC detects accidental changes to raw data

• Electronic signature
– JEDEC-standard 3-byte signature (BB20h)
– Extended device ID: two additional bytes identifydevice factory options

• JESD47H-compliant
– Minimum 100,000 ERASE cycles per sector
– Data retention: 20 years (TYP)

CATALOG

MT25QU512ABB8E12-0AAT COUNTRY OF ORIGIN

MT25QU512ABB8E12-0AAT PARAMETRIC INFO

MT25QU512ABB8E12-0AAT PACKAGE INFO

MT25QU512ABB8E12-0AAT MANUFACTURING INFO

MT25QU512ABB8E12-0AAT PACKAGING INFO

MT25QU512ABB8E12-0AAT ECAD MODELS

COUNTRY OF ORIGIN

Taiwan (Province of China)

PARAMETRIC INFO

Density (bit)	512M
Cell Type	NOR
Interface Type	Serial (SPI, Dual SPI, Quad SPI)
Block Organization	Symmetrical
Boot Block	Yes
Timing Type	Synchronous
Architecture	Sectored
Maximum Access Time (ns)	6
Maximum Cycle Time (s)	8m
Typical Operating Supply Voltage (V)	1.8
Programmability	Yes
I/O Mode	Serial
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	105
Supplier Temperature Grade	Automotive
Number of Bits per Word (bit)	1/2/4
Number of Words	512M/256M/128M
Location of Boot Block	Bottom\|Top
Maximum Operating Current (mA)	35
Programming Voltage (V)	1.7 to 2
Maximum Operating Frequency (MHz)	166
Sector Size	64Kbyte x 1024
Program Current (mA)	35
Address Bus Width (bit)	32
Minimum Operating Supply Voltage (V)	1.7
Maximum Operating Supply Voltage (V)	2
Maximum Erase Time (s)	1/Sector
Maximum Programming Time (ms)	1.8/Page
Command Compatible	Yes
ECC Support	No
Erase Suspend/Resume Modes Support	Yes
Simultaneous Read/Write Support	No
Support of Common Flash Interface	No
Support of Page Mode	No
Page Size	256byte
Minimum Endurance (Cycles)	100000
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150
Density in Bits (bit)	536870912

PACKAGE INFO

Supplier Package	TPBGA
Basic Package Type	Ball Grid Array
Pin Count	24
Lead Shape	Ball
PCB	24
Tab	N/R
Pin Pitch (mm)	1
Package Length (mm)	8
Package Width (mm)	6
Package Height (mm)	0.8
Package Diameter (mm)	N/R
Package Overall Length (mm)	8
Package Overall Width (mm)	6
Package Overall Height (mm)	1.1
Seated Plane Height (mm)	1.1
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Thin Profile Ball Grid Array
Package Family Name	BGA
Jedec	N/A

MANUFACTURING INFO

MSL	N/A
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	N/A
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	SnAgCu
Under Plating Material	N/A
Terminal Base Material	N/A
Number of Wave Cycles	N/R

PACKAGING INFO

Packaging	Tray
Quantity Of Packaging	187
Packaging Document	Link to Datasheet

ECAD MODELS