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| CATALOG |
MT29F128G08AJAAAWP-ITZ:A COUNTRY OF ORIGIN
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MT29F128G08AJAAAWP-ITZ:A PARAMETRIC INFO
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MT29F128G08AJAAAWP-ITZ:A PACKAGE INFO
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MT29F128G08AJAAAWP-ITZ:A MANUFACTURING INFO
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MT29F128G08AJAAAWP-ITZ:A PACKAGING INFO
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MT29F128G08AJAAAWP-ITZ:A ECAD MODELS
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COUNTRY OF ORIGIN
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China
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Taiwan (Province of China)
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Singapore
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PARAMETRIC INFO
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| Density (bit) |
128G |
| Cell Type |
SLC NAND |
| Interface Type |
Parallel |
| Timing Type |
Asynchronous |
| Programmability |
Yes |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Number of Bits per Word (bit) |
8 |
| Number of Words |
16G |
| ECC Support |
Yes |
| Density in Bits (bit) |
137438953472 |
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PACKAGE INFO
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| Supplier Package |
TSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
Gull-wing |
| PCB |
48 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/A |
| Package Length (mm) |
N/A |
| Package Width (mm) |
N/A |
| Package Height (mm) |
N/A |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Package |
| Package Family Name |
SO |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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ECAD MODELS
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