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Adding 2D code on Memory Component, Standard Box Barcode Label to support internal Micron automation for
ALL NAND, MCP, DRAM and NOR components.
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| CATALOG |
MT29F4G01ABAFDWB-IT:F COUNTRY OF ORIGIN
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MT29F4G01ABAFDWB-IT:F PARAMETRIC INFO
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MT29F4G01ABAFDWB-IT:F PACKAGE INFO
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MT29F4G01ABAFDWB-IT:F MANUFACTURING INFO
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MT29F4G01ABAFDWB-IT:F PACKAGING INFO
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COUNTRY OF ORIGIN
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Singapore
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PARAMETRIC INFO
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| Density (bit) |
4G |
| Cell Type |
SLC NAND |
| Interface Type |
Serial |
| Timing Type |
Synchronous |
| Programmability |
Yes |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Number of Bits per Word (bit) |
1 |
| Number of Words |
4G |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Density in Bits (bit) |
4294967296 |
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PACKAGE INFO
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| Supplier Package |
UPDFN |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
6 |
| Package Width (mm) |
8 |
| Package Height (mm) |
0.52 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6 |
| Package Overall Width (mm) |
8 |
| Package Overall Height (mm) |
0.55 |
| Seated Plane Height (mm) |
0.55 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Family Name |
DFN |
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| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tray |
| Quantity Of Packaging |
320 |
| Packaging Document |
Link to Datasheet |
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