MT29F4G16ABADAH4:D Micron IC FLASH 4G PARALLEL 63VFBGA

label:
2025/08/20 1
MT29F4G16ABADAH4:D  Micron IC FLASH 4G PARALLEL 63VFBGA


CATALOG
MT29F4G16ABADAH4:D LIFECYCLE
MT29F4G16ABADAH4:D PARAMETRIC INFO
MT29F4G16ABADAH4:D PACKAGE INFO
MT29F4G16ABADAH4:D MANUFACTURING INFO


LIFECYCLE
Obsolete
Aug 01,2018


PARAMETRIC INFO
Density (bit) 4G
Cell Type SLC NAND
Interface Type Parallel
Block Organization Symmetrical
Boot Block No
Timing Type Asynchronous
Architecture Sectored
Programmability Yes
Typical Operating Supply Voltage (V) 3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Supplier Temperature Grade Commercial
Number of Bits per Word (bit) 16
Number of Words 256M
Maximum Supply Current (mA) 35
Sector Size 128Kbyte x 4096
Program Current (mA) 35
Address Width (bit) 29
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Supply Voltage (V) 3.6
Maximum Erase Time (s) 0.003/Block
Maximum Programming Time (ms) 0.6
Command Compatible No
ECC Support Yes
Erase Suspend/Resume Modes Support No
Simultaneous Read/Write Support No
Support of Common Flash Interface No
Support of Page Mode Yes
Page Size 2Kbyte
Minimum Endurance (Cycles) 100000
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Density in Bits (bit) 4294967296


PACKAGE INFO
Supplier Package VFBGA
Basic Package Type Ball Grid Array
Pin Count 63
Lead Shape Ball
PCB 63
Tab N/R
Pin Pitch (mm) 0.8
Package Length (mm) 11
Package Width (mm) 9
Package Height (mm) 1(Max) - 0.25(Min)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Very Thin Fine Pitch Ball Grid Array
Package Family Name BGA


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A
Number of Wave Cycles N/R


Продукт RFQ