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• VDD = VDDQ = 1.35V (1.283–1.45V)
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• Backward compatible to VDD = VDDQ = 1.5V ±0.075V– Supports DDR3L devices to be backward compatible in 1.5V applications
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• Differential bidirectional data strobe
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| • 8n-bit prefetch architecture
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| CATALOG |
| MT41K512M16HA-125:A COUNTRY OF ORIGIN |
MT41K512M16HA-125:A PARAMETRIC INFO
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MT41K512M16HA-125:A PACKAGE INFO
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MT41K512M16HA-125:A MANUFACTURING INFO
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MT41K512M16HA-125:A PACKAGING INFO
|
MT41K512M16HA-125:A EACD MODELS
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|
| COUNTRY OF ORIGIN |
| China |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Type |
DDR3L SDRAM |
| Density (bit) |
8G |
| Maximum Clock Rate (MHz) |
1600 |
| Number of Bits per Word (bit) |
16 |
| Typical Operating Supply Voltage (V) |
1.35 |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
95 |
| Supplier Temperature Grade |
Commercial |
| Density in Bits (bit) |
8589934592 |
| Maximum Operating Current (mA) |
185 |
| Organization |
512Mx16 |
| Number of Internal Banks |
8 |
| Number of Words per Bank |
64M |
| Data Bus Width (bit) |
16 |
| Number of I/O Lines (bit) |
16 |
| Address Bus Width (bit) |
19 |
| Minimum Operating Supply Voltage (V) |
1.283 |
| Maximum Operating Supply Voltage (V) |
1.45 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Operating Supply Voltage (V) |
1.35 |
| Refresh Cycles |
8K |
| Maximum Refresh Cycle Time (ms) |
64 |
| Process Technology |
CMOS |
|
|
PACKAGE INFO
|
| Supplier Package |
FBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
96 |
| Lead Shape |
Ball |
| PCB |
96 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
14 |
| Package Width (mm) |
9 |
| Package Height (mm) |
0.71(Min) + 0.16 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Fine Pitch Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
170 |
| Packaging Document |
Link to Datasheet |
|
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ECAD MODELS
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