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• PC100- and PC133-compliant
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• Fully synchronous; all signals registered on positive edge of system clock
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• Internal, pipelined operation; column address can be changed every clock cycle
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• Internal banks for hiding row access/precharge
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• Programmable burst lengths (BL): 1, 2, 4, 8, or full page
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• Auto precharge, includes concurrent auto precharge and auto refresh modes
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| CATALOG |
MT48LC8M16A2P-6AAIT:L LIFECYCLE
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MT48LC8M16A2P-6AAIT:L PARAMETRIC INFO
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MT48LC8M16A2P-6AAIT:L PACKAGE INFO
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MT48LC8M16A2P-6AAIT:L MANUFACTURING INFO
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MT48LC8M16A2P-6AAIT:L ECAD MODELS
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LIFECYCLE
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Obsolete
Aug 29,2020
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PARAMETRIC INFO
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| Type |
SDRAM |
| Density (bit) |
128M |
| Maximum Clock Rate (MHz) |
167 |
| Maximum Access Time (ns) |
17|7.5|5.4 |
| Number of Bits per Word (bit) |
16 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Density in Bits (bit) |
134217728 |
| Maximum Supply Current (mA) |
100 |
| Organization |
8Mx16 |
| Number of Internal Banks |
4 |
| Number of Words per Bank |
2M |
| Data Bus Width (bit) |
16 |
| Number of I/O Lines (bit) |
16 |
| Interface Type |
LVTTL |
| Address Bus Width (bit) |
14 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
3.6 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Operating Supply Voltage (V) |
3.3 |
| Process Technology |
CMOS |
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PACKAGE INFO
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| Supplier Package |
TSOP-II |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
54 |
| Lead Shape |
Gull-wing |
| PCB |
54 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.8 |
| Package Length (mm) |
22.22 |
| Package Width (mm) |
10.16 |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Package (Type II) |
| Package Family Name |
SO |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
N/A |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
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ECAD MODELS
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