
|
|
• High Frame Rate
|
• Superior Low-light Performance
|
• Low Dark Current
|
• Global Reset Release, which Starts the
Exposure of All Rows Simultaneously
|
• Bulb Exposure Mode, for Arbitrary
Exposure Times
|
• Snapshot Mode to Take Frames on Demand
|
• Horizontal and Vertical Mirror Image
|
|
CATALOG |
MT9P031I12STC-DP COUNTRY OF ORIGIN |
MT9P031I12STC-DP LIFECYCLE
|
MT9P031I12STC-DP PARAMETRIC INFO
|
MT9P031I12STC-DP PACKAGE INFO
|
MT9P031I12STC-DP MANUFACTURING INFO
|
MT9P031I12STC-DP PACKAGING INFO
|
MT9P031I12STC-DP APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia |
|
LIFECYCLE
|
Obsolete
Mar 30,2023
|
|
PARAMETRIC INFO
|
Type |
CMOS |
Color Sensing |
Color |
Pixel Size (um) |
2.2x2.2 |
Image Size (Pixels) |
2592x1944 |
Module/IC Classification |
IC |
Minimum Operating Supply Voltage (V) |
1.7|2.6 |
Typical Operating Supply Voltage (V) |
1.8|2.8 |
Maximum Operating Supply Voltage (V) |
1.9|3.1 |
Maximum Clock Frequency (MHz) |
96 |
Minimum Operating Temperature (°C) |
-30 |
Maximum Operating Temperature (°C) |
70 |
Image Size Range (Pixels) |
>= 480,000 |
Operating Supply Voltage (V) |
1.7 to 1.9|2.6 to 3.1 |
Minimum Storage Temperature (°C) |
-40 |
Maximum Storage Temperature (°C) |
125 |
|
|
PACKAGE INFO
|
Supplier Package |
ILCC |
Pin Count |
48 |
PCB |
48 |
Tab |
N/R |
Package Length (mm) |
10 |
Package Width (mm) |
10 |
Package Height (mm) |
1.25 |
Package Diameter (mm) |
N/R |
Mounting |
Surface Mount |
Package Family Name |
LCC |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
4 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
|
|
PACKAGING INFO
|
Packaging |
Tray |
Quantity Of Packaging |
240 |
|
|
APPLICATIONS
|
• High Resolution Network Cameras
|
• Wide FOV Cameras
|
• 720 P–60 fps Cameras
|
• Dome Cameras with Electronic Pan, Tile,
and Zoom
|
• Hybrid Video Cameras with High
Resolution Stills
|
• Detailed Feature Extraction for Smart
Cameras |
|